Substrate Tiling and Sidewall Wiring for Narrow-Bezel Electronics
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Solution Overview
Problem
Current manufacturing processes for narrow bezel or bezel-less electronic devices face challenges in efficiently forming large-sized electronic devices through tiling, requiring improved methods to enhance production efficiency and reduce bezel width.
Innovation Solution
A manufacturing method involving cutting and bonding substrates with circuit layers, forming wires and encapsulating layers, and integrating electronic elements to create a tiled electronic device structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If substrates are cut and bonded to form tiled electronic devices, then large-sized electronic devices can be produced, but the manufacturing process complexity increases
Solution Approach 1:
The manufacturing process divides the substrate formation into multiple stages: first forming a base substrate with circuit layer, then cutting it into multiple first substrates, and finally bonding them to form the tiled electronic device. This segmentation allows complex large-sized devices to be manufactured through manageable steps.
Solution Approach 2:
The circuit layer is formed on the base substrate before cutting occurs. This preliminary action ensures that the circuit patterns are established while the substrate is still in a manageable state, simplifying subsequent cutting and bonding operations compared to forming circuits after tiling.
2Reliability
If wires are formed on exposed surfaces after cutting, then electrical connections are achieved, but additional manufacturing steps are required
Solution Approach 1:
Wires are formed not only on the main surface but also on the exposed side surfaces of the first substrates after cutting. This three-dimensional wire formation approach ensures electrical connections are established across the bonded interfaces, achieving reliable connectivity while integrating the wiring process with the substrate structure.
3Length of moving object
If substrates are cut to reduce bezel width, then narrow bezel or bezel-less devices are achieved, but manufacturing precision requirements increase
Solution Approach 1:
The circuit layer is formed on the base substrate before cutting, allowing precise circuit patterns to be established while the substrate is still large and manageable. This ensures that even after precise cutting to reduce bezel width, the circuit connections remain intact and functional.
Solution Approach 2:
The base substrate is cut into multiple first substrates that are then bonded together. This segmentation allows the bezel width to be reduced by distributing the display area across multiple tiles, while the cutting precision is managed through controlled division of the original substrate rather than attempting to cut a single large substrate to exact dimensions.
Data Source
AI summary
A manufacturing method of an electronic device includes providing a first substrate, wherein the first substrate includes a circuit layer; cutting the first substrate; forming a wire on a first surface which is exposed after cutting the first substrate and on a second surface of the first substrate, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer; disposing an electronic element on the circuit layer; bonding the first substrate after cutting and a second substrate to form an electronic module; and disposing a driving element on the second surface of the first substrate to be electrically connected to the wire.