Substrate Processing Timing Control for Standby Bath Uniformity

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In substrate processing apparatuses combining immersion and single-wafer processing, variations in waiting times for substrates in the standby bath lead to increased variations in processing characteristics between substrates.

Innovation Solution

A substrate processing system that includes an immersion processor, a standby bath, transfer mechanisms, and a controller. The controller determines the start timing of the immersion process for subsequent sets based on the cumulative time of transfer and processing processes for preceding sets, thereby minimizing waiting time variations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrates are processed using both immersion processor and single-wafer processor with standby bath, then processing capacity is improved, but variations in waiting times increase causing variations in processing characteristics

Engineering Contradiction:
Improveprocessing capacityVSAvoidprocessing characteristic consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The standby bath performs preliminary rinsing of substrates after immersion processing and before single-wafer processing. By pre-preparing substrates in the standby bath with controlled waiting time, the system ensures that substrates are ready for subsequent processing at the optimal time, reducing variations in total waiting time and improving processing characteristic consistency.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The control device calculates the total waiting time for each substrate by tracking the timing of transfer between processors and the standby bath. Based on this feedback information, the system adjusts the immersion processing timing for subsequent substrates to minimize waiting time variations, thereby improving processing characteristic consistency while maintaining high productivity.

Inventive Principle:
Principle #23Feedback

2Productivity

If substrates wait in standby bath for extended periods, then processing throughput is improved, but processing characteristics deteriorate due to excessive waiting time variations

Engineering Contradiction:
Improveprocessing throughputVSAvoidprocessing characteristic uniformity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The system dynamically adjusts the immersion processing timing based on the calculated total waiting times of substrates. By making the processing schedule flexible and adaptive rather than fixed, the system can optimize throughput while keeping waiting time variations within acceptable ranges, ensuring both high productivity and reliable processing characteristics.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The control device changes the processing parameters by adjusting the immersion timing for subsequent substrates based on observed waiting time variations. This parameter adjustment allows the system to maintain optimal throughput while preventing excessive waiting time variations that would deteriorate processing characteristic uniformity.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250140581A1Substrate processing apparatus and substrate processing method
Publication Date: 2025.05.01 TOKYO ELECTRON LTD
  • US20250140581A1 patent drawing
  • US20250140581A1 patent drawing
  • US20250140581A1 patent drawing

AI summary

A substrate processing apparatus includes: an immersion processor for collectively immersing a set of one or more substrates in a processing liquid and process the set; a standby bath for immersing the set in a rinsing liquid; a first transferer for transferring the set from the immersion processor to the standby bath; a first deliverer for accommodating the set after the immersion in the standby bath; a second transferer for transferring the set from the standby bath to the first deliverer; a single-wafer processor for processing the substrates one by one; a second deliverer for accommodating the substrates processed by the single-wafer processor; a third transferer for transferring the substrates one by one between the first and second deliverers and the single-wafer processor; and a controller for controlling the above-described components to execute a series of substrate processes.