Substrate Topology Mapping for Bow and Warpage Management
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Solution Overview
Problem
Substrate bow and warpage during processing adversely affect subsequent processing and handling, leading to non-uniform processing and increased breakage during handling.
Innovation Solution
A system and method for constructing a substrate topology map using a displacement sensor to measure properties associated with bow and warpage, allowing for management of substrates based on the map to mitigate these issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrate processing is performed without measuring and managing bow and warpage, then processing speed is maintained, but manufacturing precision deteriorates due to non-uniform processing
Solution Approach 1:
The system performs preliminary measurement of substrate bow and warpage using a displacement sensor before processing. The controller receives sensor data and determines the substrate topology map in advance, allowing the system to plan and adjust processing parameters beforehand. This preliminary action ensures manufacturing precision is maintained without requiring slow corrective measures during processing, thus preserving productivity.
Solution Approach 2:
The system implements a feedback loop where the displacement sensor continuously measures substrate topology, the controller processes this data to determine bow and warpage characteristics, and this information is used to adjust processing parameters. The feedback mechanism enables real-time correction of non-uniformities while maintaining efficient processing speeds through automated control.
2Reliability
If substrate handling is performed without topology information, then handling speed is maintained, but reliability deteriorates due to increased breakage
Solution Approach 1:
The system determines the substrate topology map and identifies safe handling locations before the substrate is moved. The controller uses the displacement sensor data to pre-calculate optimal pickup points that avoid high-stress regions. This preliminary preparation enables handlers to pick up substrates safely without time-consuming assessments during the handling process itself.
Solution Approach 2:
The substrate topology information serves the dual purpose of both processing guidance and handling guidance. The same sensor data that identifies processing non-uniformities also identifies safe handling locations, allowing the system to provide multiple functions from a single measurement process without requiring separate assessment steps.
3Measurement precision
If displacement sensing is performed across the entire substrate surface, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The system divides the substrate surface into multiple measurement zones that are scanned sequentially. The displacement sensor measures one zone at a time and the controller reconstructs the complete topology map by combining these segmented measurements. This segmentation allows comprehensive surface coverage with a single sensor rather than requiring a complex array of simultaneous sensors.
Solution Approach 2:
The controller acts as an intermediary that receives simple point-by-point measurements from the displacement sensor and processes this data to reconstruct the complete substrate topology map. The controller performs the complex computational work of integrating multiple measurements into a comprehensive model, allowing the physical sensing hardware to remain relatively simple while achieving high measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances uniformity in substrate processing, reduces breakage during handling, and optimizes power consumption, leading to increased yield and manufacturing throughput.
Implementation Method 1
a displacement sensor configured to measure one or more properties of a top surface of a substrate. The one or more properties are associated with substrate bow and/or substrate warpage
Data Source
AI summary
A system includes a displacement sensor configured to measure one or more properties of a top surface of a substrate. The one or more properties are associated with at least one of substrate bow or substrate warpage. The system further includes a processing device communicatively coupled to the displacement sensor. The processing device is configured to receive, from the displacement sensor, sensor data indicative of the one or more properties of the top surface of the substrate, construct a substrate topology map based on the received sensor data, and cause management of the substrate based on the substrate topology map.