Substrate Transfer Apparatus With 2D Connection Units

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In substrate processing systems, managing which processing modules (PMs) have processed wafers is challenging, especially when multiple wafers from a single container are processed in different PMs, and increasing the number of load ports (LPs) to match the number of PMs can lead to inefficient use of space and reduced throughput.

Innovation Solution

A substrate transfer apparatus with a transfer chamber and multiple connection units arranged vertically and laterally, allowing for efficient movement and mapping of containers to PMs, enabling direct transfer and retrieval of wafers while optimizing the use of space by allowing more containers than PMs, thus improving throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the number of load ports (LPs) is increased to match the number of processing modules (PMs), then the throughput of wafer processing is improved, but the area occupied by the substrate processing system becomes larger

Engineering Contradiction:
Improvethroughput of wafer processingVSAvoidarea occupied by the substrate processing system
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The connection units are arranged in a two-dimensional grid pattern (vertical and lateral directions) rather than a single linear row, allowing multiple containers to be connected in a compact configuration. This spatial reorganization enables more containers to access the transfer chamber simultaneously without proportionally increasing the system's footprint, resolving the contradiction between throughput and area occupation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The movement mechanisms enable dynamic reconfiguration of connection unit positions, allowing the system to adapt container arrangements to processing needs. This dynamic capability allows efficient utilization of space while maintaining high throughput, as containers can be repositioned to optimize access patterns without requiring fixed, space-consuming infrastructure.

Inventive Principle:
Principle #15Dynamics

2Productivity

If the number of processing modules (PMs) is increased to improve throughput, then more wafers can be processed in parallel, but the management complexity of tracking which PM processed which wafer increases

Engineering Contradiction:
Improvethroughput of wafer processingVSAvoidmanagement complexity of tracking wafer processing
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The transfer chamber with multiple connection units serves as a universal interface that can accommodate any container needing processing. Rather than requiring dedicated one-to-one mapping between containers and processing modules, the system uses the transfer chamber as a multi-functional hub that manages wafer distribution to multiple PMs, simplifying tracking and management while enabling parallel processing of multiple wafers.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If more containers are connected to the transfer chamber than the number of processing modules (PMs), then the throughput is improved by reducing idle PM time, but the system requires more load ports (LPs) which increases the system size

Engineering Contradiction:
Improvethroughput of wafer processingVSAvoidsystem size
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

By arranging connection units in a two-dimensional grid (vertical stacking combined with lateral arrangement), the system can connect more containers without linearly increasing the system's footprint. This spatial optimization allows exceeding the number of PMs in container connections while maintaining a compact form factor, enabling reduced idle PM time without proportional increase in system size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10811289B2Substrate transfer apparatus and substrate processing system comprising plural connection units arranged side by side in a vertical and lateral directions along one side surface of a transfer chamber
Publication Date: 2020.10.20 TOKYO ELECTRON LTD
  • US10811289B2 patent drawing
  • US10811289B2 patent drawing
  • US10811289B2 patent drawing

AI summary

There is provided a substrate transfer apparatus for unloading each of a plurality of target substrates, which is to be transferred to each of a plurality of processing devices, from each of a plurality of containers connected to the substrate transfer apparatus, each of the plurality of containers being configured to accommodate the plurality of target substrates. The apparatus comprises: a transfer chamber including an arm disposed to take out each of the plurality of target substrates which is to be transferred to each of the plurality of processing devices from each of the plurality of containers; a plurality of connection units arranged side by side in a vertical direction and a lateral direction along one side surface of the transfer chamber, and connected to the plurality of containers, respectively; and movement mechanisms configured to move at least one of the plurality of connection units in the lateral direction.