Non-Contact Substrate Transfer Using Vacuum and Air Cushioning
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Solution Overview
Problem
In direct bonding processes for semiconductor devices, plasma-treated surfaces of dies can become contaminated during transfer due to direct contact with transfer apparatuses, leading to weakened bonding and potential voids in the contact surface.
Innovation Solution
A substrate transfer apparatus employing a holding region with a combination of vacuum holes for suction force and air holes for buoyancy force, allowing non-contact holding and transfer of substrates, thereby preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If direct contact transfer method is used, then transfer speed is improved, but surface contamination occurs
Solution Approach 1:
The patent introduces a plasma-treated protective film as an intermediary layer between the die surface and the transfer apparatus. This film allows mechanical contact for rapid transfer while preventing direct contamination of the plasma-treated bonding surface, thus resolving the contradiction between transfer speed and surface cleanliness
Solution Approach 2:
The patent employs a dual-pressure system using vacuum (negative pressure) for holding and compressed air (positive pressure) for release. This pneumatic mechanism enables rapid contactless transfer by controlling the die's adhesion to the transfer apparatus, improving transfer speed without direct mechanical contact that would cause contamination
2Object-affected harmful factors
If contactless transfer method is used, then surface contamination is prevented, but transfer reliability deteriorates
Solution Approach 1:
The patent applies plasma treatment to the die surface in advance before transfer, creating a temporarily activated surface that forms strong adhesion with the transfer apparatus. This preliminary action ensures reliable contactless holding during transfer, while the plasma-treated protective film maintains surface integrity for subsequent bonding
Solution Approach 2:
The patent utilizes changes in pressure parameters (vacuum to atmospheric pressure transition) to control the die's adhesion state. By switching from negative pressure (holding) to positive pressure (release), the system achieves both reliable contactless transfer and prevention of surface contamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively holds and transfers substrates without direct contact, maintaining the integrity of the plasma-treated surface and preventing defects in the bonding process.
Implementation Method 1
A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate
Implementation Method 2
A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region
Data Source
AI summary
A substrate transfer apparatus includes a body portion having a holding region on a surface thereof corresponding to a substrate. The body portion moves so that the surface thereof approaches the substrate up to at least a first distance. A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate disposed at the first distance. At least some of the plurality of vacuum holes are disposed at equal intervals at an edge of the holding region and have the same width. A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.