Substrate Transfer Alignment for Supercritical Drying Stability
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Solution Overview
Problem
Conventional substrate processing systems face challenges in reducing relative displacement of substrates between the inside and outside of processing containers during supercritical drying, leading to potential issues with substrate transfer and liquid film integrity.
Innovation Solution
The substrate processing apparatus employs a configuration with a first supporting member inside the processing container and a second supporting member outside, ensuring that the center axis of the substrate matches both inside and outside the container, reducing relative positional displacement through precise alignment and support mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate is transferred between processing container inside and outside, then the substrate can be processed, but relative displacement of the substrate occurs leading to transfer errors and liquid film scattering
Solution Approach 1:
A positioning pin is introduced as an intermediary element between the substrate and the processing container. The positioning pin protrudes from the container bottom and engages with a corresponding positioning hole in the substrate, serving as a mechanical mediator that ensures accurate alignment and prevents relative displacement during transfer operations.
Solution Approach 2:
The substrate itself contains a positioning hole that works with the positioning pin to achieve self-alignment. The positioning hole is specifically designed to receive and engage with the positioning pin, allowing the substrate to self-correct its position automatically during the transfer process without requiring external adjustment mechanisms.
2Productivity
If the substrate is transferred without precise alignment, then transfer speed can be increased, but liquid film scattering and loss occur
Solution Approach 1:
The positioning pin and positioning hole are pre-configured in the processing container and substrate before transfer begins. This preliminary alignment mechanism is already in place, allowing the substrate to be quickly and accurately transferred without requiring real-time adjustment, thus maintaining high transfer speed while preventing liquid film scattering.
Data Source
AI summary
A substrate processing apparatus includes a process mechanism that processes a substrate. The process mechanism includes: a processing container that accommodates therein the substrate; a first supporting member that horizontally supports the substrate; and a second supporting member that horizontally supports the substrate at an outside of the processing container. The first supporting member and the second supporting member support the substrate such that a center axis of the substrate in the processing container and a center axis of the substrate at an outside of the processing container match, in a case where at least viewed from a direction where the substrate is carried-in to the container and carried-out from the container.