Substrate transfer device and method of cooling arm
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Solution Overview
Problem
Existing substrate transfer devices face challenges in maintaining the movement accuracy of substrate supports due to temperature changes affecting the drive mechanisms, particularly when handling hot substrates and operating at high speeds.
Innovation Solution
A substrate transfer device equipped with a cooler that distributes and supplies a cooling fluid to specific cooling target regions of the arm, based on temperature measurements and a calculated thermal index, to maintain optimal operating temperatures and prevent movement accuracy degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If cooling fluid is supplied to all regions of the arm uniformly, then the overall temperature of the arm is reduced, but the movement accuracy of the substrate support is not sufficiently improved because temperature distribution is not optimized
Solution Approach 1:
The patent applies local quality by distributing cooling fluid to different cooling target regions (first, second, and third regions) with different flow rates based on their specific thermal conditions and influence on movement accuracy. The controller adjusts the cooling flow rate to each region individually, ensuring that regions with higher thermal influence receive more cooling while reducing cooling in less critical regions, thereby optimizing movement accuracy without uniformly cooling the entire arm.
2Temperature
If cooling fluid supply amount is increased, then the cooling effect on the arm is enhanced, but the energy consumption and system complexity increase
Solution Approach 1:
The patent implements dynamics by dynamically adjusting the cooling fluid flow rate to each cooling target region based on real-time temperature measurements and the calculated thermal index. The controller continuously monitors temperature changes and modifies the cooling distribution accordingly, ensuring that cooling is applied adaptively rather than statically, which optimizes energy consumption while maintaining effective temperature control.
Solution Approach 2:
The patent applies parameter changes by varying the cooling fluid flow rate parameter across different regions and over time based on the thermal index calculation. The system changes the cooling parameters (flow rate, distribution ratio) according to the measured temperature changes and their influence on movement accuracy, thereby achieving efficient cooling with optimized energy usage.
3Productivity
If the substrate transfer device operates at high speed, then productivity is improved, but temperature changes affect the drive mechanism and reduce movement accuracy
Solution Approach 1:
The patent implements feedback by continuously measuring the temperature of each cooling target region during high-speed substrate transfer operations and using this temperature information to calculate the thermal index. The controller uses this feedback to adjust the cooling fluid distribution in real-time, compensating for temperature-induced accuracy degradation and maintaining movement precision even during high-speed operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution efficiently cools the arm in the substrate transfer device, thereby suppressing the decrease in movement accuracy of the substrate support, even under conditions of high substrate temperatures and rapid movement.
Implementation Method 1
a cooler configured to distribute and supply a cooling fluid from a fluid supply source to each of a plurality of cooling target regions of the arm
Data Source
AI summary
A substrate transfer device that transfers a substrate, includes: a transfer arm including a substrate support and an arm; a cooler configured to distribute and supply a cooling fluid from a fluid supply source to each of cooling target regions of the arm; a measuring part configured to measure a temperature of each of the cooling target regions; and a controller. The controller is configured to: calculate a thermal index for each of the cooling target regions based on the amount of change of the temperature of the cooling target region measured by the measuring part from a reference temperature and a degree of influence of the temperature of the cooling target region affecting a movement accuracy of the substrate support; and determine a distribution ratio of the cooling fluid from the fluid supply source by the cooler based on the thermal index.