Substrate Transfer Layout for Higher-Throughput Batch Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrate processing systems experience a deterioration in throughput due to the increased load on the second transport device, which is used to transport substrates through the single-wafer processing device and to a dryer device.
Innovation Solution
The substrate processing system includes a transfer device with a carrier shelf that stores substrates in a horizontal orientation, a batch processing device for processing multiple substrates at once, and a single-wafer processing device. The system reduces the load on the first substrate transport mechanism by bypassing it when transporting substrates from the transfer device to the batch processing device, using a first batch transport mechanism that receives substrates in a vertical orientation from the transfer device and transports them directly to the batch processing unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are transported through the single-wafer processing device using the second transport device, then substrates can be transferred from the loading/unloading device to the interface device, but the throughput of the substrate processing system deteriorates due to increased load on the second transport device
Solution Approach 1:
The transport function is segmented into multiple dedicated transport devices: the first transport device for loading/unloading, the second transport device for single-wafer processing, and a third transport device for batch processing. This segmentation allows each transport device to operate independently with optimized paths, preventing the throughput deterioration caused by overloading a single transport device while maintaining substrate transfer capability.
2Adaptability or versatility
If the second transport device is used to transport multiple substrates through the single-wafer processing device, then batch processing can be enabled, but the load on the second transport device increases causing throughput deterioration
Solution Approach 1:
The system segments batch processing functionality into a dedicated batch processing device with its own transport path (third transport device). This allows batch processing capability to be added without increasing the load on the second transport device, as substrates for batch processing are directly transferred from the loading/unloading device via the first transport device, maintaining overall throughput while enabling batch processing versatility.
Solution Approach 2:
The first transport device is designed with multi-functionality to serve both single-wafer processing and batch processing paths. It can transport substrates to either the single-wafer processing device or the batch processing device based on processing requirements, eliminating the need for the second transport device to handle batch processing and thus preventing throughput deterioration while maintaining adaptability.
Data Source
AI summary
A substrate processing system includes a transfer device provided with a shelf, a batch processing device, and a single-wafer processing device. The transfer device, the single-wafer processing device, and the batch processing device are linearly arranged in a row, in the order listed herein. The batch processing device includes a first batch transport mechanism that transports a plurality of substrates to a batch process bath, for example, all at once. The first batch transport mechanism receives the plurality of substrates converted into the vertical orientation on the transfer device side, and transports the substrates to, for example, a batch process bath directly, without using a substrate transport robot in the single-wafer processing device.