Substrate Transfer Device Bonding Alignment
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Solution Overview
Problem
The existing bonding systems for semiconductor devices require significant processing time due to the need to invert substrates before bonding, which can be optimized by improving the substrate transfer device's configuration to directly align bonding surfaces without the need for substrate inversion.
Innovation Solution
A substrate transfer device with a first holding part to hold the first substrate from the upper surface side, allowing its lower surface to serve as the bonding surface, and a second holding part to hold the second substrate from the lower surface side, ensuring the upper surface of the second substrate faces the first substrate, thus eliminating the need for substrate inversion during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the substrate is transferred with the bonding surface serving as the upper surface, then the substrate can be transferred to the bonding apparatus, but the bonding apparatus must invert the substrate which increases processing time
Solution Approach 1:
The patent applies inversion by changing the orientation of the substrate during transfer. Instead of transferring the substrate with the bonding surface facing up and then inverting it in the bonding apparatus, the transfer device inverts the substrate during the transfer process itself. The first holding part holds the substrate from the upper surface side, and the second holding part holds it from the lower surface side, enabling the substrate to be transferred with the bonding surface facing down, thus eliminating the need for subsequent inversion and reducing processing time
2Manufacturing precision
If the bonding apparatus inverts the substrate to align bonding surfaces, then bonding can be performed, but the inversion process increases processing time
Solution Approach 1:
The patent applies preliminary action by performing the substrate inversion during the transfer process before the substrate reaches the bonding apparatus. The first holding part and second holding part work together to invert the substrate in advance, so that when the substrate arrives at the bonding apparatus, the bonding surfaces are already aligned and ready for bonding, eliminating the need for time-consuming inversion operations in the bonding apparatus
3Productivity
If a conventional substrate transfer device is used, then substrate transfer is possible, but the bonding process requires additional inversion time
Solution Approach 1:
The patent merges the substrate transfer function with the substrate orientation adjustment function. The transfer device incorporates both the first holding part and second holding part that work together to transfer and invert the substrate in a single integrated operation. This combination of functions eliminates the need for separate inversion operations, reduces the number of process steps, and increases bonding throughput by reducing total processing time
Data Source
AI summary
A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.