Substrate Transfer Position Control for Centered Stage Placement

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Solution Overview

Problem

Current substrate transfer systems face challenges in accurately placing substrates at the centers of stages in process modules, leading to potential clearance issues and uneven substrate processing due to assembly errors and varying stage center distances.

Innovation Solution

A method of controlling the substrate transfer system involves acquiring process module-specific substrate transfer positions for each atmospheric and vacuum transfer device, allowing the vacuum transfer devices to place substrates at the centers of stages, and adjusting the atmospheric transfer device's positions to ensure accurate placement and secure clearances, thereby improving substrate processing uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If substrates are transferred using conventional transfer devices without process module-specific position adjustment, then the transfer operation is simple, but the substrate placement precision at stage centers deteriorates due to assembly errors and varying stage center distances

Engineering Contradiction:
Improvesubstrate placement precisionVSAvoidtransfer control complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The control device acquires and stores process module-specific substrate transfer positions in advance, before actual substrate transfer operations begin. These positions are predetermined based on each process module's stage center location, allowing the atmospheric transfer device to directly execute precise transfers without real-time calculations or adjustments.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system incorporates detection devices that measure the actual positions of stages in each process module, providing feedback information about stage center locations. This feedback is used by the control device to calculate and determine accurate process module-specific substrate transfer positions, ensuring substrates are placed precisely at stage centers despite assembly variations.

Inventive Principle:
Principle #23Feedback

2Stability of the object's composition

If the atmospheric transfer device uses fixed transfer positions, then the device operation is simple, but the substrate clearance uniformity across different process modules deteriorates due to varying stage center distances

Engineering Contradiction:
Improvesubstrate clearance uniformityVSAvoidtransfer device operation
Core Design Contradiction:
Stability of the object's compositionVSEase of operation

Solution Approach 1:

The system transitions from fixed, static transfer positions to dynamic, process module-specific transfer positions. The control device selects different transfer positions based on the target process module, allowing the atmospheric transfer device to adapt its transfer parameters to each module's specific geometry and stage center location, thereby maintaining uniform substrate clearances across all modules.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the transfer position parameters specific to each process module rather than using a single fixed parameter set. By acquiring and applying process module-specific substrate transfer positions, the system adjusts critical parameters (transfer location coordinates) to compensate for variations in stage center distances, ensuring consistent substrate clearances despite structural variations among process modules.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20240128110A1Method of controlling substrate transfer system
Publication Date: 2024.04.18 TOKYO ELECTRON LTD
  • US20240128110A1 patent drawing
  • US20240128110A1 patent drawing
  • US20240128110A1 patent drawing

AI summary

Provided is a method of controlling a substrate transfer system transferring substrates by controlling a first transfer device and a second transfer device comprising: a process of acquiring process module-specific substrate transfer positions for each of the plurality of process modules, wherein the process module-specific substrate transfer positions are substrate transfer positions of the mounting parts of the first transfer device for allowing the second transfer device to place substrates at centers of the stages, the second transfer device transferring substrates from the mounting parts of the load lock module to the stages of the process modules.