Substrate Transfer Mechanism Thermal Management
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Solution Overview
Problem
Conventional substrate processing systems face challenges in maintaining throughput and preventing thermal damage while controlling costs, as they require additional heating rooms and excessive heating, leading to increased costs and potential thermal damage to driving mechanism components.
Innovation Solution
A method involving a substrate transfer mechanism that repeatedly moves into and out of a heat treatment chamber for sublimating by-products, where the holding unit is heated within the chamber, eliminating the need for external heating rooms and maintaining a consistent temperature to prevent excessive heat application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heating room is provided to prevent AFS solidification on the pick, then the pick temperature is maintained and AFS adhesion is prevented, but the system cost increases and throughput is not improved
Solution Approach 1:
The heating function is merged with the heat treatment chamber by utilizing the chamber's heating capability during substrate processing. The pick is heated indirectly through thermal radiation and convection from the heated substrate and chamber environment, eliminating the need for a separate heating room while maintaining pick temperature above the AFS solidification point.
Solution Approach 2:
The heat treatment chamber serves dual purposes: (1) performing the intended heat treatment on substrates, and (2) simultaneously heating the pick to prevent AFS solidification. This multi-functionality eliminates the need for dedicated heating infrastructure, reducing system cost while maintaining reliability.
2Reliability
If the pick is excessively heated to maintain temperature during movement, then AFS adhesion is prevented, but thermal damage may occur to the driving mechanism components
Solution Approach 1:
The heating is localized to the pick and its immediate vicinity through the heat treatment chamber's thermal field. The chamber heating is concentrated on the substrate and pick area, while the driving mechanism remains outside the high-temperature zone, protected by the chamber structure. This spatial separation allows effective pick heating without exposing the driving mechanism to excessive heat.
Solution Approach 2:
The system is segmented into two thermal zones: (1) the heat treatment chamber containing the heated substrate and pick where high temperature is required, and (2) the external driving mechanism area where temperature is controlled to prevent thermal damage. This segmentation allows differential temperature control to satisfy both requirements simultaneously.
3Object-generated harmful factors
If wet cleaning is performed on the transfer arm, then AFS adhesion is removed, but the vacuum state must be restored which reduces throughput
Solution Approach 1:
The pick is deliberately allowed to accumulate AFS during normal operation, and this accumulated AFS is then utilized as a heat transfer medium during the heat treatment process. The AFS layer facilitates efficient thermal coupling between the heated substrate and the pick, converting what was previously a harmful adhesion into a beneficial thermal interface that prevents further AFS solidification.
Solution Approach 2:
The heat treatment process automatically performs the cleaning function as a byproduct. When the substrate is heated in the chamber, the thermal radiation and convection not only heat the substrate but also vaporize and remove AFS from the pick surface. This self-cleaning mechanism eliminates the need for separate wet cleaning operations, maintaining continuous throughput without vacuum restoration delays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach suppresses cost increases and prevents thermal damage to the driving mechanism components by maintaining the holding unit's temperature without excessive heating, thereby enhancing system efficiency and reliability.
Implementation Method 1
a heat treatment chamber for sublimating by-products by heat
Implementation Method 2
the holding unit is heated within the chamber, eliminating the need for external heating rooms and maintaining a consistent temperature
Data Source
AI summary
A substrate processing system comprising: a heat treatment chamber configured to sublimate by-products by heat; and a substrate carrier configured to load a substrate into the heat treatment chamber, the substrate carrier including a holder for holding the substrate, and a controller configured to control operations of the heat treatment chamber, the substrate carrier, and the holder, wherein the controller is programmed to control the sublimation to, (a) maintain a temperature of the holding unit at a level equal to or higher than a predetermined temperature, while (b) inhibiting thermal damage to the substrate transfer mechanism excluding the holding unit.