Semiconductor Substrate Transfer Layout for Compact Load Lock Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor substrate processing apparatuses face inefficiencies due to the large area occupied by components, which hinders compactness and overall processing efficiency.
Innovation Solution
The apparatus is redesigned with a substrate transfer module featuring load ports on opposite sides of the chamber, a load lock on the rear surface, and a robot arm that moves vertically within the chamber, reducing the horizontal footprint and optimizing the use of space to enhance processing efficiency per unit area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are arranged in a conventional layout, then the apparatus structure is simple, but the area occupied is large and processing efficiency per unit area is low
Solution Approach 1:
The patent transitions from a conventional horizontal arrangement of load ports to a vertical arrangement where load ports are positioned at opposite sides of the chamber with the robot arm moving vertically. This dimensional change allows better space utilization and reduces the horizontal footprint of the apparatus.
Solution Approach 2:
The load lock is integrated into the rear surface of the chamber, nesting it within the existing chamber structure rather than placing it as a separate external component. This nesting approach reduces the overall apparatus area while maintaining all necessary functions.
2Area of stationary object
If load ports are positioned on opposite sides with vertical robot arm movement, then the installation area is reduced, but the device complexity increases
Solution Approach 1:
The robot arm is designed to perform multiple functions: transferring substrates between load ports, loading/unloading the load lock, and interfacing with processing chambers. This multi-functionality reduces the need for separate dedicated components, thereby reducing overall device complexity despite the sophisticated movement requirements.
Solution Approach 2:
The patent combines the load lock function with the chamber rear surface integration, merging what could be separate components into a unified structure. This merging reduces the number of discrete parts and simplifies the overall apparatus architecture.
Data Source
AI summary
A semiconductor substrate processing apparatus includes a substrate transfer module including a chamber having an internal space extending in a first direction within the chamber, at least one pair of first load ports at opposite sides of the chamber, to face in a second direction intersecting the first direction, and configured to rotate and move a substrate carrier, a load lock at a rear surface of the chamber, and a robot arm configured to move in the first direction in the internal space of the chamber, a transfer chamber connected to the load lock of the substrate transfer module, a plurality of processing chambers connected to the transfer chamber, and a transfer arm inside the transfer chamber, and configured to unload the semiconductor substrate from the load lock and to load the semiconductor substrate into at least one of the plurality of processing chambers.