Substrate Transfer Connector for Dry Lithography
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Solution Overview
Problem
Existing substrate processing systems face inefficiencies in transferring substrates between dry lithography devices and exposure devices, particularly due to the need for load lock chambers to switch between atmospheric and vacuum pressures, which increases processing time.
Innovation Solution
A substrate processing apparatus is designed with a dry lithography device and a connector that includes a transfer space adjacent to the exposure space of the exposurer, allowing for direct transfer of substrates between the dry lithography device and the exposurer without the need for load lock chambers, thereby maintaining decompressed states and reducing processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a load lock chamber is used to transfer substrates between atmospheric and vacuum environments, then substrate transfer is enabled, but processing time increases due to pressure switching requirements
Solution Approach 1:
The patent extracts the load lock chamber from the substrate transfer path between the dry lithography device and the EUV exposure device. By removing this pressure-switching component, the system enables direct transfer between atmospheric and vacuum environments through a shared atmospheric interface, eliminating the time-consuming pressure cycling operations while maintaining proper environmental separation for each device
Solution Approach 2:
The patent introduces a transfer device with an atmospheric interface as an intermediary between the dry lithography device and the EUV exposure device. This intermediary operates entirely in the atmospheric environment, allowing substrates to be transferred without pressure changes, while separate vacuum interfaces maintain the required vacuum environments for the exposure device
2Adaptability or versatility
If a load lock chamber is used for substrate transfer, then pressure environment switching is achieved, but device complexity increases
Solution Approach 1:
The patent removes the load lock chamber from the system architecture, simplifying the overall device structure. The pressure environment switching capability is maintained through a reconfigured transfer system that operates in the atmospheric environment, eliminating the need for vacuum chambers, bellows, and complex pressure control systems associated with traditional load locks
Solution Approach 2:
The transfer device is designed with multi-functionality, serving as a universal interface that can transfer substrates between different device types (dry lithography device and EUV exposure device) without requiring pressure environment changes. This universal atmospheric interface replaces the specialized pressure-switching function of the load lock chamber
Data Source
AI summary
A substrate processing apparatus includes a dry lithography device configured to perform a lithography process on a substrate mainly by a gas; and a connector configured to connect the dry lithography device to an exposurer configured to expose the substrate. The connector includes a transfer space which is adjacent to an exposure space of the exposurer and through which the substrate is transferred between the exposurer and the dry lithography device.