Substrate Transfer Control for Mounting Part Overstay Prevention
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in preventing substrates from staying in the substrate mounting part for a time longer than an allowable time, which can lead to substrate alteration and inefficiencies in processing.
Innovation Solution
A substrate processing apparatus and method that includes a control system to manage the transfer of substrates between a carrier, a substrate mounting part, processing units, and transfer devices, ensuring that substrates are transferred and processed within predetermined time intervals to prevent prolonged stays in the substrate mounting part, utilizing a control device to coordinate the operations of first and second transfer devices to maintain efficient processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are temporarily mounted on the substrate mounting part during transfer operations, then substrate transfer between carrier and processing parts is enabled, but all substrates may stay in the substrate mounting part for a time longer than allowable time
Solution Approach 1:
The system performs preliminary actions by having the first transfer device take out substrates from the carrier and mount them on the substrate mounting part in advance, before the processing parts are fully utilized. This preliminary mounting enables subsequent processing operations to proceed without waiting for carrier-substrate interactions, thereby reducing overall substrate staying time in the mounting part while maintaining operational ease
Solution Approach 2:
The control device coordinates both transfer devices to operate continuously and simultaneously - the first transfer device continuously mounts substrates from carrier to mounting part while the second transfer device continuously transfers substrates from mounting part to processing parts. This continuous coordinated operation prevents substrate accumulation and ensures substrates are processed without unnecessary delays, resolving the contradiction between operational ease and time loss
2Productivity
If the first transfer device takes out multiple substrates from carrier and mounts them on substrate mounting part, then processing throughput is improved, but substrate staying time in mounting part increases
Solution Approach 1:
Both transfer devices operate continuously and simultaneously - the first transfer device continuously mounts substrates from carrier to mounting part while the second transfer device continuously transfers substrates from mounting part to processing parts. This continuous coordinated operation ensures high productivity while preventing substrate accumulation and excessive staying time in the mounting part
Solution Approach 2:
The control device monitors the positions and states of both transfer devices and substrates in real-time, dynamically coordinating their operations. This feedback mechanism ensures that substrates are mounted and transferred at optimal rates, maintaining high productivity while preventing any substrate from staying in the mounting part longer than necessary
3Device complexity
If substrates remain in substrate mounting part for extended periods, then transfer coordination between devices is simplified, but substrate alteration occurs due to prolonged air exposure
Solution Approach 1:
Both transfer devices operate continuously to mount and transfer substrates without interruption. This continuous operation simplifies transfer coordination by establishing a steady rhythm while simultaneously minimizing substrate staying time in the mounting part, thereby preventing substrate alteration from prolonged air exposure
Solution Approach 2:
The substrate mounting part serves as a brief intermediary zone where substrates are temporarily held during transfer. By optimizing the coordination of both transfer devices, this intermediary zone minimizes substrate residence time, preventing harmful air exposure while maintaining simplified transfer coordination
Data Source
AI summary
A substrate processing apparatus according to an embodiment includes a carrier mounting part, a substrate mounting part, a first transfer device, a plurality of processing parts, a second transfer device and a controller. The carrier mounting part mounts a carrier that accommodates a plurality of substrates. The first transfer device transfers the substrates between the carrier and a substrate mounting part. The controller causes the first transfer device to execute a take-out operation for taking out the substrate from the carrier to mount the substrate on the substrate mounting part at time intervals equal to or longer than a time required for the first transfer device to take out the substrate from the carrier to mount the substrate on the substrate mounting part and to take out the substrate from the substrate mounting part to accommodate the substrate in the carrier.