Substrate Transfer Device Position Deviation Compensation
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Solution Overview
Problem
In semiconductor manufacturing, particularly in photolithography processes, achieving high accuracy in transferring substrates like wafers between modules is challenging due to position deviations caused by high-speed operation and thermal effects, which affect the reproducibility and precision of the transfer mechanism.
Innovation Solution
A substrate transfer device equipped with a substrate holding unit, a first detecting unit to determine the substrate's position, a second detecting unit to measure position deviations, and a position determining unit to calculate the precise transfer position, ensuring accurate alignment and positioning of the substrate during transfer between modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the transfer mechanism operates at high speed to improve productivity, then the transfer efficiency increases, but position deviation occurs due to operational repetition and thermal effects
Solution Approach 1:
The patent employs detectors to measure the actual positions of the substrate holding unit and individual members, then feeds this information back to the control unit. The control unit calculates position deviations and adjusts transfer positions accordingly, enabling real-time compensation for high-speed operational deviations while maintaining both speed and precision
Solution Approach 2:
The system dynamically changes transfer parameters (position coordinates) based on detected deviations. By adjusting the transfer position parameters in real-time according to measured position errors, the system compensates for thermal expansion and high-speed operation effects without reducing transfer speed
2Manufacturing precision
If the position reproducibility of the substrate holder is improved to achieve high accuracy, then the transfer precision increases, but the device complexity increases due to additional detection and control mechanisms
Solution Approach 1:
The control unit receives position information from detectors and automatically calculates corrections, eliminating the need for complex mechanical adjustment mechanisms. This feedback-based automated control achieves high precision while keeping the mechanical structure relatively simple
Solution Approach 2:
The patent replaces complex mechanical positioning adjustment mechanisms with an automated control system that uses detectors and computational algorithms to achieve precise positioning. This substitution reduces mechanical complexity while maintaining or improving precision
3Productivity
If the width of the ring-shaped region where resist is removed is minimized to improve yield, then the manufacturing quality improves, but the positioning accuracy requirement increases
Solution Approach 1:
By continuously detecting actual positions and feeding back to the control system, the patent ensures that the substrate is transferred to the precise preset position each time. This enables consistent high-accuracy positioning that minimizes the ring-shaped resist removal region and maximizes chip yield
Solution Approach 2:
The system performs preliminary detection of substrate position and transfer mechanism position before the actual transfer. Based on these detections, the control unit pre-calculates and adjusts the transfer position to ensure the substrate arrives at the exact preset position, thereby minimizing the resist removal region
Data Source
AI summary
A device includes a substrate holding unit 25 configured to hold a substrate and be movable in a transversal direction to transfer the substrate from one module to another module; a first detecting unit 3 configured to detect a position of the substrate on the substrate holding unit 25 before the substrate holding unit 25 transfers the substrate into the another module after receiving the substrate from the one module; second detecting units 55 and 56 configured to detect a position deviation between a position of the substrate holding unit 25, which is located at a temporary position set to transfer the substrate into the another module, and the temporary position; and a position determining unit 10 configured to determine a transfer position where the substrate is transferred into the another module based on the position of the substrate on the substrate holding unit 25 and the position deviation.