Substrate Transfer Mechanism for Positional Displacement Control
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Solution Overview
Problem
Existing substrate processing devices face issues with positional displacement during substrate transfer, leading to incomplete cleaning of specific regions on substrates, such as the lower surface central and outer regions, due to the lack of horizontal movement capability in the transfer device and insufficient positioning accuracy.
Innovation Solution
A substrate processing device and method that includes a transportation device with a holding part capable of loading and unloading substrates between processing units, featuring a chamber with distinct processing positions and a main robot that accurately positions substrates using position information and a fixing device to maintain precise alignment during transfer between the first and second processing positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the transfer device uses support pins with lower rigidity to move the substrate vertically, then the substrate can be transferred between holding devices, but the substrate may vibrate and displace from the correct position
Solution Approach 1:
The pin linking member acts as an intermediary component that connects multiple support pins and provides a reference frame. When the pin linking member moves vertically, it carries all support pins together, ensuring they move in unison and maintain their relative positions, thus preventing substrate displacement while enabling transfer between holding devices
Solution Approach 2:
The transfer device is segmented into multiple independent support pins rather than using a single rigid structure. This allows the substrate to be supported at multiple points, distributing the load and reducing vibration impact on any single point, while the pin linking member coordinates their movement
2Device complexity
If the transfer device lacks horizontal movement capability to correct positional displacement, then the device structure remains simple, but the substrate cannot be repositioned if displacement occurs
Solution Approach 1:
The positioning is corrected in advance by the upper holding device before transfer occurs. The upper holding device precisely positions the substrate at the first processing position, and the lower holding device receives it at the correctly positioned second processing position, preventing displacement from affecting cleaning completeness
Solution Approach 2:
The system uses position information about the substrate's location to control the movement of the pin linking member and holding devices, ensuring that the substrate is transferred to the correct position. This feedback mechanism ensures processing reliability without requiring complex horizontal adjustment mechanisms in the transfer device
Data Source
AI summary
A substrate cleaning device includes a chamber, a first processing part and a second processing part. The chamber forms a processing space including a first processing position and a second processing position. The first processing part performs a first process on a substrate disposed at the first processing position in the chamber. The second processing part performs a second process on the substrate disposed at the second processing position in the chamber. A main robot loads and unloads the substrate with respect to the substrate cleaning device by moving a hand holding the substrate. In addition, the main robot receives the substrate disposed at the first processing position by causing the hand to enter the processing space, transporting the substrate to the second processing position, and positioning the substrate.