Substrate Transfer Layout for Dummy Wafer Isolation
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Solution Overview
Problem
The existing substrate processing apparatuses face inefficiencies due to interference between the transfer of dummy and product substrates, leading to reduced productivity, particularly when multiple processing units are used, as both indexer and main transfer robots are involved in transferring dummy substrates, occupying the carrier holding portion for extended periods, and causing delays in product substrate transfers.
Innovation Solution
The apparatus is redesigned with an indexer block and adjacent processing block layers stacked in an up-down direction, incorporating dummy-substrate housing portions within the processing block layers, allowing dummy substrates to be transferred without involving the indexer robot, and optimizing the arrangement of substrate and dummy-substrate housing portions to minimize interference and reduce transfer loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dummy substrates are transferred through the same path as product substrates using both indexer robot and main transfer robot, then the processing unit can be washed using dummy substrates, but interference in transfer occurs between dummy substrate and product substrate, reducing transfer efficiency and productivity
Solution Approach 1:
The transfer system is segmented into two independent paths: one for product substrates (indexer robot to delivery unit) and another for dummy substrates (housing portion within processing block to processing unit). This segmentation eliminates interference between dummy and product substrate transfers, resolving the contradiction between maintaining washing capability and preserving transfer efficiency.
Solution Approach 2:
The dummy substrate housing portion is extracted from the carrier holding portion and integrated directly into the processing block structure. This extraction allows dummy substrates to be supplied locally without occupying the carrier holding portion, eliminating the need for indexer robot involvement in dummy substrate transfer and preventing transfer path interference.
2Reliability
If the carrier holding portion is occupied by the dummy carrier for extended periods during dummy substrate transfer, then dummy substrate processing can be completed, but waiting time occurs for product substrate carry-in, reducing productivity
Solution Approach 1:
The dummy substrate housing portion is positioned in a different spatial dimension (within the processing block structure) rather than in the carrier holding portion. This dimensional relocation allows simultaneous access to the carrier holding portion for product substrates and the housing portion for dummy substrates, eliminating waiting time and resolving the time loss contradiction.
3Productivity
If multiple processing units are used to concurrently process product substrates, then processing capacity increases, but the transfer load on indexer robot and main transfer robot increases, hindering productivity enhancement
Solution Approach 1:
The processing block structure provides self-service for dummy substrate supply through the integrated housing portion and internal transfer mechanism. This self-service capability eliminates the need for external indexer and main transfer robots to handle dummy substrates, reducing their transfer load and complexity while maintaining the ability to support multiple processing units for high processing capacity.
Data Source
AI summary
A substrate processing apparatus includes an indexer block and a processing block adjacent to the indexer block in a lateral direction of the indexer block. A plurality of processing block layers are stacked in an up-down direction in the processing block. The indexer block includes a container holding portion and a first transfer robot that transfers a substrate between the substrate container held by the container holding portion and the processing block. Each of the processing block layers includes a plurality of processing units, a substrate placing portion, a dummy-substrate housing portion, and a second transfer robot that transfers a substrate between the substrate placing portion and the plurality of processing units and that transfers a dummy substrate between the dummy-substrate housing portion and the plurality of processing units.