Substrate Transfer Teaching Using Edge-Based Eccentricity Correction
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Solution Overview
Problem
Existing transfer devices face challenges in accurately determining and correcting the eccentricity of substrates during transfer operations, leading to potential misalignment and inefficiencies in substrate processing.
Innovation Solution
A teaching method for a transfer device that utilizes a pick and a mapping sensor to detect the edge of a substrate, sets a teaching position, and estimates eccentricity by rotating the stage to detect the substrate's position locus, allowing for precise correction of receiving positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a transfer robot transfers a dummy workpiece to detect eccentricity, then transfer deviation can be confirmed, but the process requires multiple manual intervention steps and dummy workpiece preparation
Solution Approach 1:
The patent extracts the eccentricity detection function from a separate dummy workpiece and integrates it directly into the actual substrate. By using the substrate's own edge and notch mark as detection targets, the system eliminates the need for dummy workpieces and reduces process complexity while maintaining measurement precision
Solution Approach 2:
The substrate serves multiple functions: it is both the object to be transferred and the object used for eccentricity detection. The edge and notch mark on the substrate are utilized for both positioning during transfer and for detection by the direction/position determination device, reducing the need for separate calibration components
2Manufacturing precision
If the direction/position determination device detects eccentricity, then transfer accuracy can be improved, but additional equipment and setup time are required
Solution Approach 1:
The patent incorporates the detection of edge position and notch mark position as preliminary actions during the normal transfer process. The direction/position determination device measures these features automatically as the substrate is being positioned, rather than requiring separate setup procedures, thereby improving transfer accuracy without significantly complicating the manufacturing process
Solution Approach 2:
The system uses the direction/position determination device to provide real-time feedback on the substrate's position and orientation during transfer. By continuously monitoring the edge position and notch mark position, the system can detect and correct deviations, improving transfer accuracy while maintaining ease of manufacture through automated feedback control
3Measurement precision
If multiple measurement points are taken to determine eccentricity, then measurement accuracy improves, but measurement time increases
Solution Approach 1:
The patent measures both the edge position and the notch mark position on the substrate, using these partial measurements to calculate eccentricity. By selecting specific key features (edge and notch mark) rather than measuring the entire substrate surface, the system achieves sufficient measurement accuracy while minimizing measurement time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables accurate and automated correction of substrate eccentricity, improving transfer precision and reducing misalignment issues, thereby enhancing the efficiency of substrate processing operations.
Implementation Method 1
a mapping sensor to detect a position of an edge of the substrate
Data Source
AI summary
A teaching method for a transfer device provided with a pick configured to hold a substrate and a mapping sensor, includes detecting a position of an edge of the substrate arranged in a teaching target module by the mapping sensor and setting a teaching position in one horizontal direction, transferring the substrate from the teaching target module to a stage of an alignment device by the pick based on the set teaching position, rotating the stage by a predetermined angle and detecting a locus of the position of the edge of the substrate, and estimating an eccentricity amount between the stage and the substrate based on the detected locus of the position of the edge of the substrate.