Substrate Transfer Layout for Edge Exposure Throughput
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Solution Overview
Problem
The semiconductor manufacturing process is hindered by the inefficiency of main transfer robots, which spend excessive time transferring edge-exposed substrates between liquid treatment and heat treatment chambers, leading to reduced substrate productivity.
Innovation Solution
The introduction of a substrate processing apparatus and method that separates the main transfer robot's role from edge-exposed substrate handling, utilizing an interface robot to unload substrates from the edge exposure chamber, allowing the main transfer robot to focus on liquid and heat treatment processes, thereby increasing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the main transfer robot transfers edge-exposed substrates between liquid treatment chamber and heat treatment chamber, then the substrate can undergo complete processing, but the transfer time increases and productivity decreases
Solution Approach 1:
The patent divides the transfer robot functions into two separate robots: the main transfer robot handles substrates between liquid treatment and heat treatment chambers, while the interface robot handles edge-exposed substrates between edge exposure chamber and main transfer robot. This segmentation eliminates the time-consuming repeated transfers of edge-exposed substrates by the main transfer robot, thereby resolving the contradiction between processing completeness and productivity.
Solution Approach 2:
The interface robot acts as an intermediary between the edge exposure chamber and the main transfer robot. It receives edge-exposed substrates from the edge exposure chamber and transfers them to the main transfer robot, which then transfers them to the liquid treatment chamber. This intermediary role prevents the main transfer robot from directly handling edge-exposed substrates, reducing transfer time and improving productivity while maintaining complete processing.
2Reliability
If the main transfer robot repeatedly loads substrates to edge exposure chamber and transfers them back, then edge exposure processing is completed, but the transfer cycle time increases
Solution Approach 1:
The patent segments the transfer functions by assigning the interface robot to handle all transfers between the edge exposure chamber and the main transfer system. The main transfer robot is relieved of edge exposure substrate handling, focusing only on transfers between liquid treatment and heat treatment chambers. This segmentation eliminates repeated transfer cycles involving the main transfer robot for edge-exposed substrates, reducing transfer cycle time while ensuring edge exposure is completed.
Solution Approach 2:
The interface robot provides self-service by autonomously handling edge-exposed substrates between the edge exposure chamber and the main transfer robot. It loads substrates into the edge exposure chamber, waits for edge exposure completion, then unloads them and transfers them to the main transfer robot. This self-service mechanism eliminates the need for the main transfer robot to repeatedly service the edge exposure chamber, reducing transfer cycle time while maintaining processing reliability.
Data Source
AI summary
Disclosed is a substrate processing apparatus and a substrate processing method that may increase the amount of substrates produced by preventing a main transfer robot that transfers a substrate between a liquid treatment chamber and a heat treatment chamber from transferring an edge-exposed substrate. The substrate processing apparatus may include: an index module; a buffer module; a treatment module; and an interface module, in which the index module includes: a load port in which a container receiving a substrate is placed; and an index frame provided with an index robot for transferring the substrate between the container placed in the load port and the buffer module, the buffer module is provided with a buffer in which the substrate is placed, the treatment module includes: a liquid treatment chamber for liquid treating the substrate loaded from the buffer module; a heat treatment chamber for heat treating the substrate received from the buffer module; and a transfer chamber disposed between the liquid treatment chamber and the heat treatment chamber, and provided with a main transfer robot for transferring substrates to the buffer module, the liquid treatment chamber, and the heat treatment chamber, respectively, the interface module includes: an interface frame positioned between the treatment module and an external exposure device; an edge exposure chamber disposed within the interface frame and performing edge exposure processing on the substrate; and an interface robot disposed within the interface frame and transferring the substrate, and each of the main transfer robot and the interface robot loads or unloads the substrate into or from the edge exposure chamber.