Substrate Transfer Position Calibration for Precise Etching Alignment
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in accurately and efficiently adjusting the transfer position of substrates due to misalignment errors, particularly in etching processes where manual adjustments are prone to inaccuracies and require significant operator time.
Innovation Solution
The substrate processing apparatus incorporates a measurement unit to acquire etching rates at multiple points on a concentric circle around the substrate, generates approximate curves based on these rates, calculates linear expressions representing movement directions, and determines the intersection coordinate to adjust the substrate transfer position accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual teaching is performed to correct the error in relative position between the edge ring and the substrate, then the alignment accuracy is improved, but the operator time and adjustment complexity increase significantly
Solution Approach 1:
The patent replaces manual visual checking and mechanical adjustment with an automated optical measurement system. The measurement unit captures images of the substrate and edge ring, automatically calculates position coordinates, and determines the intersection point of linear expressions to establish the correct transfer position, eliminating the need for operator intervention in the adjustment process
Solution Approach 2:
The system performs self-adjustment through automated calculation and control. The controller automatically processes measurement data, calculates position coordinates and linear expressions, determines the intersection point, and adjusts the transfer position without requiring external operator input, enabling the system to correct alignment errors autonomously
Solution Approach 3:
The patent introduces an automated measurement and calculation system as an intermediary between the edge ring positioning and substrate transfer processes. This intermediary system measures the actual positions, calculates the required adjustments through linear expressions, and communicates the corrected transfer position to the transfer mechanism, bridging the gap between mechanical positioning and precise alignment
2Measurement precision
If multiple measurements are taken at different transfer positions to calculate the intersection coordinate, then the adjustment precision is improved, but the processing time and measurement complexity increase
Solution Approach 1:
The patent divides the measurement process into discrete steps: measuring at multiple transfer positions, generating separate linear expressions for each position, and calculating their intersection. This segmentation allows the complex measurement task to be broken down into manageable components that can be processed systematically by the controller
Solution Approach 2:
The system implements feedback by using the measured positions and calculated linear expressions to determine the correct transfer position. The measurement results are fed back into the calculation process, and the calculated intersection point is used to adjust the transfer position, creating a closed-loop system that continuously refines the alignment accuracy
Data Source
AI summary
A substrate processing apparatus includes a process module that includes: a stage having a first surface on which a substrate is placed and a second surface, a process module including an edge ring placed on the second surface, a measurement unit measuring an etching rate of the substrate; and a controller. The controller transfers the substrate to different transfer positions on the first surface and etches the substrate for each transfer position, acquires etching rates at points on a concentric circle of the substrate in an end of the substrate, for each transfer position, from the measurement unit, generates an approximate curve of each of the concentric circles based on each of the acquired etching rates for each transfer position, calculates each linear expression representing a movement direction of the substrate, based on the approximate curve for each transport position, and calculates an intersection coordinate of the linear expressions.