Substrate Transfer Hand with Variable Height Supports
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Solution Overview
Problem
Existing substrate transfer hands face challenges in supporting large and thin substrates without causing warping or increasing the risk of electrostatic discharge (ESD), as they require numerous support pins to maintain rigidity and horizontal posture, leading to potential vibrations and ESD risks.
Innovation Solution
A substrate transfer hand design featuring a combination of first and second transverse hand supports with varying contact point heights, intentionally warping the substrate to enhance rigidity while reducing the number of contact points, thereby minimizing vibrations and ESD risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large number of support pins are used to maintain horizontal posture and reduce warping, then the substrate stability is improved, but the risk of electrostatic discharge (ESD) increases
Solution Approach 1:
The hand support structure implements local quality by creating different height levels (first height and second height) among support pins. This allows certain regions to have higher pins for stability while other regions have lower pins to reduce ESD risk, optimizing both stability and safety simultaneously
Solution Approach 2:
The support pin structure is segmented into two distinct groups: first support pins at a first height and second support pins at a second height. This segmentation allows the system to achieve stability through the first pins while minimizing ESD contact points through the second pins
2Stability of the object's composition
If a large number of support pins are used to maintain horizontal posture, then the substrate warping is reduced, but unnecessary vibrations occur when external force is applied
Solution Approach 1:
Different height levels are assigned to different regions of support pins, creating a structured support pattern that provides horizontal posture maintenance while reducing vibration transmission across the entire substrate surface
3Object-affected harmful factors
If the number of contact points with the substrate is reduced, then the risk of electrostatic discharge (ESD) is reduced, but the substrate rigidity may be compromised
Solution Approach 1:
The support system uses local quality by positioning higher support pins at specific locations to provide rigidity where needed, while using lower support pins at other locations to minimize ESD contact points, achieving both rigidity and reduced ESD risk
Solution Approach 2:
The contact points are segmented into two height levels, allowing the system to maintain substrate rigidity through strategic placement of higher pins while reducing overall ESD risk through the presence of lower pins with minimal contact
Data Source
AI summary
A substrate transfer hand includes a longitudinal hand support extending in a longitudinal direction, and first and second transverse hand supports coupled to the longitudinal hand support and extending transversely to the longitudinal direction of the longitudinal hand support. Each of the first transverse hand supports includes a plurality of first contact points aligned in a direction in which the first transverse hand support extends and capable of contacting a substrate. The maximum height position of the first contact points is a first height. Each of the second transverse hand supports includes a plurality of second contact points aligned in a direction in which the second transverse hand support extends and capable of contacting the substrate. The maximum height position of the second contact points is a second height that is lower than the first height.