Substrate Transfer Holding Structure for Edge or Back-Surface Contact
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Solution Overview
Problem
Existing substrate handling technologies lack the ability to dynamically adjust the holding position based on the type of substrate, which can lead to inefficiencies and potential damage during transfer processes.
Innovation Solution
A transfer device equipped with a first holding part that contacts the edge of the substrate and a second holding part with an elastic member that contacts only the back surface, allowing for adaptable holding positions based on substrate type.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single holding part design is used for all substrates, then the device structure is simple, but the substrate type adaptability deteriorates
Solution Approach 1:
The holding part is divided into two independent components: a first holding part that contacts the edge part of the substrate and a second holding part with an elastic member that contacts the back surface. This segmentation allows each component to be independently activated based on substrate type, enabling adaptability without requiring a completely different holding mechanism for each substrate variety.
Solution Approach 2:
The holding part transitions from a static single-design structure to a dynamic multi-mode structure where the first and second holding parts can be selectively activated. The elastic member in the second holding part provides dynamic adjustment capability, allowing the holding mechanism to adapt its contact points and forces based on the specific substrate being processed.
2Productivity
If the holding position is fixed, then the device operation is simple, but the handling efficiency for different substrate types deteriorates
Solution Approach 1:
The holding part is designed to perform multiple functions through a single integrated structure. By incorporating both the first holding part (edge contact) and the second holding part (back surface contact with elastic member), the same holding assembly can handle different substrate types with different optimal holding positions, eliminating the need for multiple specialized holding devices.
Solution Approach 2:
The holding position parameters are made variable rather than fixed. The system can change which holding part is active (first or second) and adjust the contact characteristics (rigid edge contact vs. elastic back surface contact) based on substrate type, allowing optimization of transfer efficiency for each substrate variety without complicating the overall device operation.
3Reliability
If edge-gripping is used for all substrates, then the structure is simple, but substrate damage risk increases
Solution Approach 1:
Different holding strategies are applied to different regions of the substrate based on local requirements. The first holding part applies edge-gripping which is suitable for certain substrate types, while the second holding part with elastic member provides distributed back surface contact for substrates that are more susceptible to edge damage. This local quality approach optimizes substrate protection for each type.
Solution Approach 2:
The elastic member in the second holding part provides beforehand cushioning by distributing the holding force across the back surface of the substrate. This prevents concentrated stresses at the edges that could lead to substrate damage, while still providing secure holding. The elastic deformation of the member absorbs potential impact forces during substrate transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible and secure handling of various substrates by changing the holding position according to their type, preventing damage and ensuring efficient transfer operations.
Implementation Method 1
a second holding part formed with an elastic member and configured to contact only a back surface of the substrate when holding the substrate
Data Source
AI summary
According to one aspect of the present disclosure, a transfer device has a first holding part configured to contact an edge part of a substrate when holding the substrate, and a second holding part formed with an elastic member and configured to contact only a back surface of the substrate when holding the substrate.


