Substrate Transfer Interface With Immersion Bath for Higher Throughput
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Solution Overview
Problem
Existing substrate processing systems face inefficiencies in transferring substrates between batch and single-wafer processing sections, leading to interference and reduced productivity due to overlapping movement paths of transfer arms.
Innovation Solution
A substrate processing system with a second interface section that includes an immersion bath and a second transfer device with independent transfer arms, allowing for simultaneous operation of transfer devices without interference, and utilizing supercritical fluid drying to prevent pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single transfer device is used to move substrates between batch and single-wafer processing sections, then device complexity is reduced, but productivity decreases due to interference and overlapping movement paths
Solution Approach 1:
The transfer function is segmented into two independent transfer devices: a first transfer device for moving substrate lots between the batch processing section and interface section, and a second transfer device for moving individual substrates between the interface section and single-wafer processing section. This segmentation eliminates movement path interference and enables simultaneous operation, resolving the contradiction between productivity improvement and device complexity.
2Reliability
If transfer arms operate in overlapping movement ranges, then device complexity is minimized, but reliability decreases due to interference between transfer devices
Solution Approach 1:
The interface section acts as an intermediary zone between the batch processing section and single-wafer processing section. It includes an immersion bath positioned outside the movement range of the first transfer device, where substrates are temporarily held and processed. This intermediary structure allows independent operation of both transfer devices without movement path interference, improving reliability while maintaining a manageable device configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances productivity by enabling independent operation of transfer devices and prevents pattern collapse during substrate processing, thereby improving throughput and efficiency.
Implementation Method 1
an immersion bath disposed outside a movement range of the first transfer device and configured to immerse the wafer lot
Implementation Method 2
utilizing supercritical fluid drying to prevent pattern collapse
Data Source
AI summary
A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed; a single-wafer processing section in which the substrates of the wafer lot is processed one by one; and an interface section that delivers the substrates between the batch processing section and the single-wafer processing section. The batch processing section includes: a processing bath in which the wafer lot is immersed and processed; and a first transfer device that transfers the wafer lot to the processing bath. The interface section includes: an immersion bath disposed outside a movement range of the first transfer device and that immerses the wafer lot; and a second transfer device that holds and transfers the wafer lot between the first transfer device and the immersion bath.