Substrate Transfer Apparatus with Inclined Cavity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to prevent damage to semiconductor substrates and chips during transfer, as particles from the backside grinding process can contaminate and damage other substrates and chips, despite efforts to address this issue in existing technologies.
Innovation Solution
A substrate transfer apparatus with a body featuring a cavity and an attaching unit that forms negative pressure, including a through hole connecting to the external space and an inclined side surface, reduces contact with particles by maintaining a non-contact area and preventing negative pressure-induced deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate transfer apparatus contacts the semiconductor substrate during transfer, then the substrate can be moved, but particles on the substrate contaminate the contact surface and damage other substrates or chips
Solution Approach 1:
The patent extracts the harmful contact interaction between the substrate transfer apparatus and the substrate surface by introducing a liquid medium. The liquid layer separates the apparatus contact surface from the substrate, allowing transfer while preventing direct contact that would cause particle damage. This extraction of the harmful contact element resolves the contradiction between transfer capability and contamination prevention.
Solution Approach 2:
The patent introduces liquid as an intermediary substance between the substrate transfer apparatus and the semiconductor substrate. This liquid mediator enables the transfer function while simultaneously preventing direct contact that would transfer particles to the substrate or apparatus. The intermediary liquid layer thus resolves the contradiction by providing a protective buffer zone.
2Ease of operation
If negative pressure is applied to suction the substrate, then the substrate can be held and transferred, but the negative pressure may cause deformation or damage to thin substrates
Solution Approach 1:
The patent applies beforehand cushioning by introducing a liquid layer between the negative pressure source and the substrate before the suction force is applied. This liquid cushion absorbs and distributes the negative pressure, preventing direct transmission of high stress to the thin substrate that would cause deformation or breakage, while still enabling effective substrate holding.
Solution Approach 2:
The patent changes the physical state and pressure distribution parameters by using liquid to mediate the negative pressure application. The liquid transforms the concentrated negative pressure into a distributed force through its fluid properties, changing how the suction force is transmitted to the substrate and thereby preventing damage while maintaining holding capability.
3Ease of operation
If the contact surface area is increased to improve suction, then better substrate holding is achieved, but greater contact area increases the risk of particle damage
Solution Approach 1:
The patent extracts the harmful direct contact element by replacing solid-to-solid contact with liquid-mediated contact. The liquid layer allows the substrate to be held through the liquid interface rather than direct solid contact, enabling sufficient suction strength while eliminating the particle transfer pathway that would occur with increased solid contact area.
Solution Approach 2:
The patent applies hydraulic principles by using liquid pressure distribution to achieve substrate holding. Instead of relying on solid contact area, the system uses liquid pressure transmitted through the fluid medium to hold the substrate, thereby decoupling the holding strength from the contact area and eliminating particle damage risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces cracking and damage to semiconductor substrates and chips by minimizing contact with particles and maintaining equal internal and external air pressures, enhancing the prevention of contamination and deformation.
Implementation Method 1
an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate
Implementation Method 2
at least one through hole penetrating the first and second surfaces and connecting the cavity to an external space
Data Source
AI summary
A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.