Substrate Transfer Interface With Image-Guided Liquid Supply
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Solution Overview
Problem
Existing substrate processing systems face challenges in maintaining operational efficiency when transferring substrates from batch processors to single-wafer processors due to splashing of processing liquids on lyophobic surfaces, leading to decreased operation rates and potential substrate damage.
Innovation Solution
Incorporation of an image capturer to capture the upper surface of substrates and a control circuit to determine whether a processing liquid, such as pure water, should be supplied based on the surface characteristics, ensuring appropriate liquid application only on lyophilic surfaces to prevent splashing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If processing liquid is supplied to substrates during transfer, then drying suppression is achieved, but liquid splashing occurs on lyophobic surfaces causing substrate damage
Solution Approach 1:
The system performs preliminary surface characterization using an image capturer to identify whether the substrate surface is lyophilic or lyophobic before the transfer process begins. Based on this preliminary detection, the control circuit pre-determines whether to activate the processing liquid supply, thereby preventing harmful liquid splashing before it can occur.
Solution Approach 2:
The image capturer provides real-time feedback on the substrate surface characteristics during the transfer process. The control circuit continuously monitors this feedback and dynamically adjusts the processing liquid supply accordingly - activating it only when the surface is lyophilic and suppressing it when the surface is lyophobic, thus preventing liquid splashing while maintaining drying suppression.
2Productivity
If processing liquid supply is activated continuously, then drying suppression is maintained, but operation rate decreases due to splashing incidents
Solution Approach 1:
The processing liquid supply system transitions from a static, continuous operation mode to a dynamic, conditional operation mode. The control circuit dynamically adjusts the liquid supply activation based on real-time surface characteristic detection, enabling the system to adapt its behavior to match the actual substrate conditions and optimize both productivity and reliability.
Solution Approach 2:
The system applies different processing liquid supply strategies to different substrate surface types. Instead of a uniform approach, it provides localized quality control by suppressing liquid supply for lyophobic surfaces while maintaining it for lyophilic surfaces, thereby optimizing the overall process stability and operation rate.
3Adaptability or versatility
If surface characterization is performed using image capture, then appropriate liquid supply control is achieved, but device complexity increases
Solution Approach 1:
An image capturer is introduced as an intermediary device between the substrate and the processing liquid supply system. This intermediary captures optical information about the substrate surface characteristics and transmits it to the control circuit, which then translates this information into appropriate liquid supply control decisions, enabling surface-specific control without requiring direct physical contact or complex sensing mechanisms.
Solution Approach 2:
The system replaces complex mechanical or chemical surface sensing mechanisms with optical image capture technology. By using non-contact optical methods to characterize the substrate surface, the system achieves surface-specific control while minimizing the increase in device complexity compared to traditional mechanical sensing approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances operational efficiency by preventing liquid splashing and substrate damage, thereby maintaining high operation rates and preserving substrate integrity during transfer.
Implementation Method 1
an image capturer configured to capture the upper surface of the substrate
Implementation Method 2
a processing liquid supply configured to supply a processing liquid, which suppresses drying of an upper surface of the substrate held by the substrate holder, to the upper surface of the substrate
Data Source
AI summary
A substrate processing system includes: a batch processor configured to collectively process substrates; a single-wafer processor configured to process the substrates one by one; an interface configured to deliver the substrates from the batch processor to the single-wafer processor; and a control circuit, wherein the interface includes: a substrate holder configured to hold a substrate among the substrates; a processing liquid supply configured to supply a processing liquid, which suppresses drying of an upper surface of the substrate held by the substrate holder, to the upper surface of the substrate; and an image capturer configured to capture the upper surface of the substrate, and wherein the control circuit performs control for determining whether the processing liquid supply supplies the processing liquid to the upper surface of the substrate based on an image of the upper surface of the substrate captured by the image capturer.