Substrate Transfer Liquid Film Control for Pattern Integrity
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Solution Overview
Problem
Existing substrate processing systems face challenges in efficiently transitioning substrates from batch processing to single-wafer processing while maintaining the integrity of substrate patterns, particularly due to surface tension issues during liquid film formation and handling.
Innovation Solution
A substrate processing system that includes a second delivery table with a pure water supply unit forming a liquid film on the substrate surface, allowing for upright transfer and horizontal processing, which maintains the substrate pattern integrity by using a second rinse liquid to prevent surface tension effects during transfer and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are transferred from batch processing to single-wafer processing, then productivity and processing efficiency are improved, but substrate patterns may collapse due to surface tension effects during liquid film formation
Solution Approach 1:
The patent introduces a two-stage liquid film formation process using different liquids as intermediaries. First, a rinse liquid is used to form an initial liquid film during batch processing transfer. Then, a second liquid with controlled surface tension is supplied to form a second liquid film before single-wafer processing. This intermediary approach prevents direct contact between the substrate and processing liquids that would cause surface tension-induced pattern collapse, thereby maintaining pattern integrity while enabling efficient transfer between processing modes.
2Reliability
If a liquid film is formed on substrate surface during transfer, then substrate protection and cleaning are improved, but surface tension causes pattern collapse
Solution Approach 1:
The patent changes the physical parameters of the liquid film by using two different liquids with different surface tension characteristics. The rinse liquid provides initial protection during batch processing, while the second liquid is specifically selected to have surface tension properties that prevent pattern collapse. By controlling liquid parameters (surface tension, viscosity) and film thickness, the system maintains substrate protection without causing the harmful surface tension effects that lead to pattern collapse.
3Productivity
If substrates are held upright during batch processing, then processing capacity is improved, but liquid film formation and control become more difficult
Solution Approach 1:
The patent applies preliminary action by forming the first liquid film during batch processing and then immediately supplying a second liquid to form a second liquid film before the substrate is transferred to single-wafer processing. This preliminary liquid film formation prepares the substrate surface in advance, creating a protective barrier that simplifies subsequent handling and processing. The pre-formed liquid films reduce the complexity of liquid control during transfer operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances productivity and prevents substrate pattern collapse by ensuring consistent liquid film formation and transfer, improving throughput and substrate quality in single-wafer processing.
Implementation Method 1
supplying a pure water toward the upper surface of the substrate, thereby forming a second liquid film of the pure water on the upper surface of the substrate
Data Source
AI summary
A substrate processing method includes: receiving, by a transfer arm, a substrate from a batch processing section in which a plurality of substrates is collectively processed in a state where each of the plurality of substrates stands upright; disposing the substrate on a disposing unit including a pin, a first liquid film being formed on an upper surface of the substrate from a process in the batch processing section; supplying a pure water toward the upper surface of the substrate, thereby forming a second liquid film of the pure water on the upper surface of the substrate; stop supplying the pure water and maintaining the second liquid film on the upper surface of the substrate for a predetermined time, and transporting the substrate to a single wafer processing section in which the plurality of substrates are processed one by one in a horizontal state.