Substrate Transfer Mechanism for Semiconductor Processing Efficiency

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Solution Overview

Problem

The existing substrate processing systems face inefficiencies due to increased transfer operations and prolonged processing times, particularly when carriers are transferred between the carrier-placement unit and the stocker, leading to reduced work processing amounts and operational rates.

Innovation Solution

A substrate processing apparatus is designed with a carrier-placement unit, a retreat-placement unit, processing block, first-transfer module, second-transfer module, buffer module, and control unit to optimize transfer operations, ensuring that substrates are processed efficiently by reducing unnecessary transfers and maintaining the sequential order of substrate processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the carrier is transferred between the carrier-placement unit and the stocker to increase the number of wafers unloaded, then the work processing amount is improved, but the number of transfer operations increases and processing time is prolonged

Engineering Contradiction:
Improvework processing amountVSAvoidprocessing time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The system performs preliminary actions by having the first transfer mechanism prepare carriers in advance and position them at the carrier-placement unit before substrates need to be transferred. This allows the second transfer mechanism to immediately load substrates onto available carriers without waiting for carrier retrieval from the stocker, thereby reducing processing time while maintaining increased productivity

Inventive Principle:
Principle #10Preliminary action

2Productivity

If the carrier is transferred between the carrier-placement unit and the stocker, then the operational rate of the processing block is improved, but the complexity of the transfer mechanism increases

Engineering Contradiction:
Improveoperational rateVSAvoidtransfer mechanism complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The transfer function is segmented into two independent mechanisms: the first transfer mechanism dedicated to carrier transfer between the stocker and carrier-placement unit, and the second transfer mechanism dedicated to substrate transfer between the processing block and carrier. This segmentation allows each mechanism to operate independently and efficiently, improving operational rate while keeping each individual mechanism relatively simple

Inventive Principle:
Principle #1Segmentation

3Stability of the object's composition

If substrates are transferred through multiple modules to maintain sequential order, then the processing order is maintained, but the number of transfer operations increases

Engineering Contradiction:
Improvesequential processing orderVSAvoidwork processing amount
Core Design Contradiction:
Stability of the object's compositionVSProductivity

Solution Approach 1:

The first transfer mechanism performs preliminary carrier preparation and positioning actions before the second transfer mechanism begins substrate loading. This preliminary action ensures that carriers are ready in the correct sequence at the carrier-placement unit, allowing substrates to be transferred in sequential order directly to the appropriate carriers without requiring multiple intermediate transfer operations, thus maintaining processing order while improving productivity

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS9004788B2Substrate processing apparatus, substrate processing method, and storage medium
Publication Date: 2015.04.14 TOKYO ELECTRON LTD
  • US9004788B2 patent drawing
  • US9004788B2 patent drawing
  • US9004788B2 patent drawing

AI summary

A substrate processing apparatus is disclosed equipped with a transfer mechanism that transfers a substrate processed at a processing block to a carrier so that the increase of the number of transfer process is suppressed, improving the processing efficiency. The substrate processing apparatus is configured in such a way that, when a second-transfer module houses at least one substrate and a carrier that can house the at least one substrate is not placed in a carrier-placement unit, the at least one substrate is transferred to a buffer module. When the second transfer module houses at least one substrate and the carrier that can house the at least one substrate is placed in the carrier-placement unit, the at least one substrate is transferred to the carrier, regardless of whether or not a substrate is being transferred from the buffer module to the carrier.