Substrate Transfer Layout With Orthogonal Conveyance Paths

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The substrate processing device in existing technologies faces interference between the main and sub-conveyance mechanisms, leading to reduced throughput.

Innovation Solution

A substrate processing module with a first and second conveyance mechanism that moves substrates in orthogonal directions, allowing for independent movement paths and reducing interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a main conveyance mechanism and a sub-conveyance mechanism are used to move substrates in a substrate processing device, then the substrate can be conveyed in multiple directions, but the two conveyance mechanisms may interfere with each other when moving

Engineering Contradiction:
Improvesubstrate conveyance capabilityVSAvoidconveyance operation stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies dimensionality change by moving the first conveyance mechanism from a horizontal plane to a vertical plane. Specifically, the first conveyance mechanism conveys substrates above the first region (in the vertical direction), while the second conveyance mechanism conveys substrates in a different region (horizontal direction). This spatial separation in different dimensions eliminates interference between the two conveyance mechanisms while maintaining multi-directional substrate conveyance capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If multiple conveyance mechanisms are disposed in the same region to enable flexible substrate movement, then conveyance versatility is improved, but the moving order is restricted and throughput is reduced

Engineering Contradiction:
Improveconveyance path flexibilityVSAvoidsubstrate processing throughput
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent resolves the throughput issue by utilizing vertical space for the first conveyance mechanism, allowing it to operate independently above the first region. This enables parallel operations where both conveyance mechanisms can move substrates simultaneously without waiting for each other, thereby improving throughput while maintaining conveyance flexibility.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the substrate conveyance system into two independent operational zones: the first conveyance mechanism operates in the vertical direction above the first region, while the second conveyance mechanism operates horizontally in a different region. This segmentation allows independent control and simultaneous operation of both mechanisms, eliminating restrictions on moving order and improving overall productivity.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP4693385A1Substrate processing module and substrate processing device
Publication Date: 2026.02.11 DAIKIN FINETECH LTD
  • EP4693385A1 patent drawingFigure 1
  • EP4693385A1 patent drawingFigure 2
  • EP4693385A1 patent drawingFigure 3

AI summary

A substrate processing module and a substrate processing module include: a first tank and a second tank that are arranged in a first direction and in which a substrate can be disposed; a first conveyance mechanism that moves the substrate in the first direction; and a second conveyance mechanism that moves the substrate in a second direction intersecting the first direction, wherein the first tank and the second tank are disposed in a first region, the first conveyance mechanism conveys the substrate in the first direction in a second region disposed above the first region, and the second conveyance mechanism conveys the substrate in the second direction in a third region different from the second region.