Substrate Transfer Alignment for Overlapping Wafer Detection
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Solution Overview
Problem
Current substrate transfer devices cannot simultaneously transfer and detect the positions of multiple substrates efficiently, as the positions of the substrates interfere with each other during simultaneous transfer, leading to reduced productivity in integrated circuit manufacturing.
Innovation Solution
A substrate transfer device with a transfer part, detection part, and control part that includes first and second transfer members to move substrates such that their positions can be simultaneously detected by overlapping them and using light emitting and receiving members to precisely position and align the substrates for accurate detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If two substrates are simultaneously transferred among apparatuses, then productivity is improved, but position detection becomes impossible due to mutual interference
Solution Approach 1:
The detection process is segmented into two separate sequential detection phases. During the first phase, the first substrate is detected while the second substrate is positioned in a detection-avoidance region. During the second phase, the substrates switch roles and the second substrate is detected while the first substrate is in the avoidance region. This temporal segmentation of detection tasks eliminates mutual interference and enables accurate position detection during simultaneous transfer operations.
2Device complexity
If substrates are transferred along overlapping paths, then device complexity is reduced, but detection accuracy deteriorates due to position interference
Solution Approach 1:
The solution introduces a temporal dimension to the detection process by implementing periodic, alternating detection phases. Instead of attempting simultaneous spatial detection of both substrates, the system alternates detection timing between the two substrates as they traverse the overlapping path. This transforms a spatial detection conflict into a temporal sequence, allowing both substrates to share the same physical path while maintaining detection accuracy through time-separated measurement opportunities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simultaneous detection and transfer of multiple substrates, improving productivity in integrated circuit manufacturing by ensuring accurate positioning and alignment without interference, allowing for efficient handling in various semiconductor device processes.
Implementation Method 1
the detection part may include a light emitting member and a light receiving member disposed to be faced with each other in a vertical direction centering a path along with the first and the second substrates
Data Source
AI summary
A transfer part may move the first substrate and the second substrate such that the first substrate and the second substrate are overlapped with each other when the transport transfers the first substrate and the second substrate. The detection part may detect a first position of the first substrate and a first position of the second substrate at points apart from a reference point where the first substrate and the second substrate are overlapped by first distances, and may detect respective second positions at points apart from the reference point by second distances. A control part may control movements of the first and the second substrates by the transfer part based on output of the detection part.