Substrate Holder Transfer Overlap for Faster Wafer Cleaning
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Solution Overview
Problem
Existing substrate processing devices face challenges in improving throughput due to the time required for cleaning each substrate, which hampers the efficiency of processing large numbers of substrates.
Innovation Solution
A substrate processing device and method that utilize multiple holders and movers to overlap the periods of rotation stop and horizontal or vertical movement operations, allowing simultaneous cleaning of both the center and outer regions of a substrate, thereby reducing overall processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential cleaning processing is performed on substrates using a single holder, then cleaning quality is maintained, but processing time per substrate increases and throughput decreases
Solution Approach 1:
The substrate holder is divided into two independent holders: a first substrate holder for holding the peripheral portion and a second substrate holder for holding the lower-surface center region. This segmentation allows simultaneous independent operation of cleaning and transfer processes, enabling parallel execution of multiple operations that were previously sequential, thereby reducing total processing time and increasing throughput
Solution Approach 2:
The first substrate holder performs preliminary cleaning of the peripheral portion before the substrate is fully transferred to the second holder. This preliminary action allows the cleaning process to begin earlier in the transfer sequence, overlapping cleaning time with transfer time and reducing the overall processing time per substrate
2Productivity
If multiple substrate holders and coordinated movement systems are used to reduce processing time, then throughput improves, but device complexity increases
Solution Approach 1:
The first substrate holder serves multiple functions: it holds the substrate during initial positioning, performs preliminary cleaning of the peripheral portion, and facilitates transfer to the second holder. This multi-functionality reduces the need for additional dedicated components, thereby limiting the increase in device complexity while still achieving throughput improvement through parallel operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the throughput of substrate processing by optimizing the cleaning process, enabling faster transfer and cleaning of substrates with reduced operational overlap.
Implementation Method 1
a brush cleaner configured to bring a brush into contact with the lower-surface center region of the substrate held by the first substrate holder to clean the lower-surface center region and bringing the brush into contact with a lower-surface outer region surrounding the lower-surface center region of the substrate held by the second substrate holder to clean the lower-surface outer region
Implementation Method 2
the substrate cleaning device described in JP 5904169 B2 includes two suction pads for holding the back-surface peripheral portion of a wafer
Data Source
AI summary
A substrate is held by an upper holding device, and a lower-surface center region of the substrate is cleaned. During this cleaning, a suction holder of a lower holding device located below the upper holding device is rotated. The substrate held by the upper holding device is transferred to a suction holder of the lower holding device. A lower-surface outer region of the substrate held by the suction holder is cleaned. After the lower-surface center region of the substrate is cleaned and until the substrate is transferred to the suction holder of the lower holding device, rotation of the lower holding device is stopped. Further, the suction holder is moved in a horizontal direction by a base device. A rotation stopping operation for the suction holder and a horizontal moving operation for the suction holder are performed such that the periods for these operation at least partially overlap with each other.