Substrate Transfer Module With Vacuum Particle Discharge
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Solution Overview
Problem
The challenge in semiconductor manufacturing is maintaining a clean environment in substrate transfer modules to prevent particle transfer to substrates, which affects yield due to adhering particles from friction during substrate handling.
Innovation Solution
A substrate transfer module with a transfer chamber and base plate design that includes grooves and through holes, coupled with a discharge system to collect and remove particles using vacuum pressure, preventing them from adhering to substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate transfer module operates in a conventional clean room environment, then substrate transfer functionality is maintained, but particles are generated during substrate handling and may adhere to substrates, affecting yield
Solution Approach 1:
The patent extracts the harmful particles from the transfer chamber by introducing a discharge tube that leads particles outside the clean room environment. The discharge tube connects to a particle collection system that removes particles from the transfer chamber, preventing them from adhering to substrates while maintaining normal transfer operations.
Solution Approach 2:
The patent introduces an intermediary particle collection system between the transfer chamber and the external environment. This system includes a discharge tube and particle collection device that mediates the removal of particles without disrupting the substrate transfer process, acting as a buffer that captures particles before they can contaminate substrates.
2Ease of manufacture
If the transfer chamber bottom surface is made smooth and flat for easy cleaning, then maintenance is simplified, but particles generated during substrate transfer have nowhere to collect and may adhere to substrates
Solution Approach 1:
The patent segments the bottom surface of the transfer chamber by introducing grooves that divide the surface into multiple regions. These grooves create particle collection zones where particles can settle and be discharged, while the remaining flat surfaces maintain ease of cleaning. The segmented structure allows particles to be directed into specific collection areas without complicating the overall cleaning process.
Solution Approach 2:
The patent applies local quality by creating grooves in specific locations on the bottom surface where particles are most likely to accumulate. The grooves are strategically positioned to capture particles without affecting the overall smoothness of the chamber. This localized modification allows the majority of the surface to remain easy to clean while providing dedicated particle collection zones.
3Object-affected harmful factors
If vacuum pressure is continuously applied to discharge particles, then particle removal efficiency is maximized, but energy consumption increases and may affect substrate handling stability
Solution Approach 1:
The patent implements periodic action by applying vacuum pressure intermittently rather than continuously. The vacuum is activated at specific intervals or under specific conditions (such as when particles are detected or at the end of transfer cycles), allowing particle discharge while conserving energy. This periodic application maintains particle removal effectiveness while reducing overall energy consumption compared to continuous vacuum operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively collects and discharges particles, enhancing cleanliness and reducing yield loss by preventing particle adherence during substrate transfer, thus improving manufacturing efficiency.
Implementation Method 1
vacuum pressure applied to the discharge tube may allow particles collected inside a space between the base plate and the chamber groove to be discharged to the outside space
Data Source
AI summary
A substrate transfer module, which provides clean environment to prevent particles from moving to a substrate, and semiconductor manufacturing equipment including the same. The substrate transfer module of the semiconductor manufacturing equipment includes a transfer chamber providing a transfer space of the substrate, having a chamber groove lowered by a predetermined height from a bottom surface to form a gap with respect to the bottom surface, a guide member provided in an inside portion of the transfer chamber, and a substrate transfer robot configured to move along the guide member and to transfer the substrate.