Substrate Transfer Path Control for Higher Chamber Throughput
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Solution Overview
Problem
In substrate processing apparatuses, the occurrence of substrate stagnation in transfer chambers and unused time in process chambers leads to reduced throughput and film-forming uniformity due to varying processing times in different process chambers.
Innovation Solution
A substrate processing apparatus with a controller that calculates substrate transferable times and selects optimal transfer paths to minimize stagnation by controlling the transfer structure, ensuring efficient use of process chambers and transfer chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a parallel operation of processing substrates in multiple process chambers is performed, then productivity is improved, but substrate stagnation occurs in transfer chambers leading to reduced throughput
Solution Approach 1:
The controller calculates the substrate transferable time in advance for each process chamber and determines the optimal transfer path before actual transfer occurs. This preliminary calculation and planning enables the system to proactively avoid stagnation by selecting transfer paths that account for varying processing times in different chambers, thereby maintaining continuous substrate flow and improving throughput
Solution Approach 2:
The system dynamically adjusts substrate transfer paths based on real-time processing status in each chamber. By continuously monitoring and recalculating transferable times, the transfer structure can adapt its movement patterns to match the varying processing durations across chambers, preventing stagnation while maintaining parallel operation efficiency
2Productivity
If substrate transfer is controlled with fixed timing, then ease of operation is improved, but unused time in process chambers increases reducing productivity
Solution Approach 1:
The controller continuously monitors the processing status in each process chamber and uses this feedback information to dynamically adjust substrate transfer timing. By calculating transferable times based on actual chamber status and adjusting transfer paths accordingly, the system optimizes chamber utilization without requiring complex manual control, as the automated feedback loop handles the coordination
Solution Approach 2:
The system performs self-optimization by automatically calculating transferable times and selecting optimal transfer paths without external intervention. The controller autonomously coordinates substrate transfers based on processing chamber status, eliminating the need for complex external scheduling while maximizing chamber utilization through intelligent, adaptive timing
Data Source
AI summary
There is provided a technique capable of improving the throughput by suppressing stagnation of a substrate in a transfer chamber and by reducing unused time. According to one aspect thereof, a substrate processing apparatus includes: a plurality of process chambers in which a substrate among a plurality of substrates is capable of being processed; a transfer chamber provided with a transfer structure capable of transferring the substrate; and a controller configured to be capable of: (a) calculating a substrate transferable time during which the substrate is capable of being transferred to each of the plurality of process chambers; (b) selecting a substrate transfer path to a process chamber among the plurality of process chambers such that the substrate transferable time is the shortest among those calculated in (a); and (c) performing a control of the transfer structure based on the substrate transfer path selected in (b).