Substrate Transfer Interface for Pattern-Collapse-Free Processing

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Solution Overview

Problem

Existing substrate processing systems face inefficiencies in transitioning between batch and single-wafer processing, leading to increased time and potential damage to substrates due to surface tension and pattern collapse during liquid processing.

Innovation Solution

A substrate processing system with a carry-in/out section, batch processing section, single-wafer processing section, and interface sections that include a standby table and transfer mechanisms to manage substrates horizontally and vertically, using pure water to prevent pattern collapse and improve throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrates are processed in batch mode with liquid immersion, then processing efficiency is improved, but pattern collapse and substrate damage occur due to surface tension

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidpattern collapse
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

A transfer mechanism acts as an intermediary between batch and single-wafer processing sections, enabling substrates to be moved individually on their main surfaces while maintaining batch processing capability. This intermediary system prevents pattern collapse by avoiding liquid immersion during transfer operations.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The processing system is segmented into distinct batch processing and single-wafer processing sections, allowing different processing modes to operate independently and simultaneously. This segmentation enables selective application of liquid processing only where beneficial while avoiding it where harmful.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If substrates are transferred between processing sections, then flexibility is improved, but processing time increases due to transition delays

Engineering Contradiction:
Improveprocessing flexibilityVSAvoidprocessing time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The transfer mechanism enables continuous substrate movement between batch and single-wafer processing sections without interrupting the overall processing flow. Substrates are transferred on their main surfaces in a continuous manner, eliminating idle time and maintaining productive action throughout the system.

Inventive Principle:
Principle #20Continuity of useful action

3Manufacturing precision

If substrates are held upright in batch processing, then liquid processing effectiveness is improved, but substrate stability decreases during transfer

Engineering Contradiction:
Improveliquid processing effectivenessVSAvoidsubstrate stability
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The system dynamically adjusts substrate orientation based on processing requirements. Substrates are held upright during batch liquid processing for effectiveness, then rotated to horizontal orientation on the transfer mechanism for stable movement, and finally positioned appropriately for single-wafer processing. This dynamic reconfiguration optimizes both processing effectiveness and transfer stability.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances productivity and minimizes substrate damage by allowing independent operation of transfer devices and maintaining substrate stability during transitions, reducing the risk of pattern collapse and improving overall processing efficiency.

Implementation Method 1

minimizes substrate damage by allowing independent operation of transfer devices and maintaining substrate stability during transitions, reducing the risk of pattern collapse

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Data Source

PatentUS12444623B2Substrate processing system and substrate processing method
Publication Date: 2025.10.14 TOKYO ELECTRON LTD
  • US12444623B2 patent drawing
  • US12444623B2 patent drawing
  • US12444623B2 patent drawing

AI summary

A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed in a state where each of the plurality of substrates stand upright; a single-wafer processing section in which the plurality of substrates included in the wafer lot are processed one by one in a horizontal state; and an interface section that delivers the plurality of substrates from the batch processing section to the single-wafer processing section. The interface section includes: a standby table that horizontally holds a substrate in a state of being in contact with pure water; and a transfer mechanism that delivers the substrate from the batch processing section to the standby table.