Substrate Transfer Mechanism With Peripheral Contact Lift Pins
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Solution Overview
Problem
Conventional substrate lift pins cause particle generation and damage during substrate transfer in processing tools, leading to contamination and reduced yield in semiconductor fabrication.
Innovation Solution
A substrate processing system with a substrate input/output chamber, transfer chamber, and processing chambers, featuring stacked carrier holders with support members and alignment pads, and a susceptor with carrier lift pins that minimize contact with the substrate's major surfaces using softer tips to prevent scratching and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate lift pins contact the backside of the substrate during transfer, then substrate support and transfer are achieved, but particle generation and substrate damage occur
Solution Approach 1:
The lift pins are configured to contact only the peripheral region of the substrate backside, avoiding contact with the central active area. This localized contact approach provides sufficient mechanical support for transfer while eliminating the harmful effect of particles generated from contact with the substrate's active regions.
Solution Approach 2:
The invention uses a carrier replica or template that replicates the substrate perimeter geometry. This carrier copy engages with the substrate's peripheral features to provide support and transfer capability without direct pin-to-substrate contact in the harmful regions, thus preventing particle generation while maintaining transfer reliability.
2Reliability
If conventional substrate lift pins contact the backside of the substrate during transfer, then substrate support is achieved, but substrate damage and scratching occur
Solution Approach 1:
The lift pins are positioned to contact only the peripheral region of the substrate backside, avoiding contact with the central active area. This localized contact approach provides sufficient mechanical support for transfer while eliminating the harmful effect of damage to the substrate's active regions.
Solution Approach 2:
The invention introduces a carrier or transfer mechanism that acts as an intermediary between the lift pins and the substrate. This intermediate carrier provides the necessary support and transfer function while preventing direct harmful contact between the pins and the substrate's vulnerable active areas.
3Productivity
If lift pins contact the substrate during transfer, then substrate transfer is achieved, but contamination of the chamber and substrate occurs
Solution Approach 1:
The transfer mechanism is designed to contact only the peripheral region of the substrate, keeping the central active area free from contact-induced contamination. This localized approach maintains transfer efficiency while preventing particles from contaminating the chamber and subsequent substrates.
Solution Approach 2:
The invention extracts or removes the harmful contact function from the transfer mechanism. By using a carrier-based approach where the carrier contacts the substrate periphery rather than direct pin-to-substrate contact, the harmful particle generation and contamination effects are eliminated while maintaining the necessary transfer functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces particle generation and substrate damage during transfer, enhancing yield by minimizing contact with the substrate's major surfaces and using softer materials to prevent scratching.
Implementation Method 1
a platen having a heat transfer element embedded therein
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
A substrate processing system is disclosed which includes a substrate input/output chamber coupled to a transfer chamber, and one or more processing chambers coupled to the transfer chamber, wherein the substrate input/output chamber includes a plurality of stacked carrier holders, and one of the carrier holders includes a substrate carrier to support a substrate thereon.