Substrate Transfer Pick Position Correction in Vacuum Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, existing multi-chamber vacuum processing apparatuses face challenges in accurately transferring substrates between the transfer device's pick and the susceptor due to positional deviations, which affect the precision of vacuum processing.
Innovation Solution
A substrate processing apparatus with a transfer device, position detecting device, elevating device, and control device that performs teaching processing to adjust the pick's position by calculating and correcting deviations using a detector and corrector, ensuring accurate substrate placement on the susceptor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a teaching processing is performed to adjust the position of the pick, then the substrate transfer accuracy is improved, but the complexity of the control system increases due to the need for position detection and adjustment mechanisms
Solution Approach 1:
The system implements feedback by detecting the actual position of the substrate using a position detecting device, comparing it with the intended position, and using this information to adjust the pick position. This closed-loop feedback mechanism enables automatic correction of positional deviations, improving transfer accuracy while managing control complexity through systematic error compensation.
Solution Approach 2:
The patent replaces manual or purely mechanical position adjustment with an automated control system that uses detection devices and control algorithms. The control device automatically calculates correction amounts and adjusts the pick position based on detected deviations, substituting complex mechanical adjustment mechanisms with a more manageable electronic control system.
2Manufacturing precision
If the pick position is adjusted through teaching processing, then the substrate placement precision on the susceptor is improved, but the processing time increases due to the additional detection and adjustment steps
Solution Approach 1:
The system performs position detection and adjustment in advance during a teaching processing phase before actual substrate production transfers. By pre-adjusting the pick position based on detected deviations, the system eliminates the need for repeated adjustments during normal operation, thereby improving placement precision without significantly impacting overall processing time.
Solution Approach 2:
The control system automatically performs position detection, calculation of correction amounts, and adjustment of the pick position without requiring external intervention. This self-service capability streamlines the teaching processing, reducing the time required for position adjustment while maintaining high precision substrate placement.
Data Source
AI summary
A substrate processing apparatus includes a transfer device, having a first pick configured to hold the substrate, configured to transfer a substrate; a detecting device configured to detect a position of the substrate; a susceptor configured to place the substrate thereon; an elevating device configured to move the substrate up and down; and a control device. The control device comprises an adjuster configured to perform a teaching processing; a detector configured to deliver the substrate from the first pick to the susceptor and from the susceptor to the first pick, and configured to detect a first position of the substrate, which is delivered from the susceptor to the first pick, by the detecting device; and a corrector configured to correct the position of the first pick based on a deviation amount between the first position of the substrate and a reference position.