Multi-Substrate Transfer Alignment Using Piezo Support Members

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Solution Overview

Problem

Existing substrate transfer systems face challenges in improving throughput when transferring multiple substrates, as the complexity of pin driving units and the need for transfer arm movement in X and Y directions degrade alignment throughput.

Innovation Solution

A substrate transfer system that includes a transfer unit with a holding member to hold at least two substrates parallel to a horizontal direction, multiple mounting tables with support members that can move vertically and horizontally, and movement units to independently adjust the position of each substrate, allowing for efficient alignment and separation of substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a substrate transfer device uses a plurality of pins driven horizontally for each wafer to correct horizontal positional deviation, then positioning precision is improved, but device complexity and throughput are degraded

Engineering Contradiction:
Improvehorizontal positioning precisionVSAvoidpin driving unit complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces the complex mechanical pin driving system with a combination of a transfer robot for gross movement and piezo actuators for fine positioning. The transfer robot moves the wafer holder to approximate positions, while piezo actuators attached to the wafer holder perform precise horizontal positioning with sub-micrometer accuracy, eliminating the need for complex multi-directional pin driving mechanisms.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The positioning function is segmented into two independent stages: gross positioning by the transfer robot and fine positioning by the piezo actuators. This segmentation allows each component to be optimized for its specific function, with the robot handling large movements and the piezo actuators handling precise adjustments, thereby reducing overall system complexity while maintaining high positioning accuracy.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If the transfer arm moves in X and Y directions to align each wafer, then positioning precision is improved, but productivity is degraded

Engineering Contradiction:
Improvewafer alignment precisionVSAvoidalignment throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The transfer robot performs preliminary gross positioning of the wafer holder to the approximate target location before the wafer is transferred to the mounting table. This preliminary action reduces the subsequent positioning burden on the mounting table's piezo actuators, enabling faster alignment and improving overall throughput while maintaining precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces the transfer arm's X-Y directional movement system with a more efficient combination: the transfer robot provides rapid gross positioning, and the piezo actuators on the mounting table provide fast, precise fine positioning. This substitution eliminates the need for complex multi-axis transfer arm movements, significantly improving alignment throughput.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If pins are driven horizontally for each wafer to correct position, then manufacturing precision is improved, but loss of time is increased

Engineering Contradiction:
Improvehorizontal position accuracyVSAvoidtime for position correction
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent replaces the time-consuming horizontal pin driving operation with a faster piezo actuator-based positioning system. The piezo actuators can rapidly adjust the wafer holder position with sub-micrometer precision in a single step, eliminating the sequential pin-by-pin adjustment process and significantly reducing the time required for position correction.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the positioning mechanism from mechanical pin driving to piezo actuation, which operates on different physical principles (electromechanical conversion). This parameter change enables faster response times and more rapid position correction while maintaining or improving positioning accuracy, thereby reducing the time loss associated with position adjustment.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250183079A1Substrate Transport System and Substrate Position Adjustment Method
Publication Date: 2025.06.05 TOKYO ELECTRON LTD
  • US20250183079A1 patent drawing
  • US20250183079A1 patent drawing
  • US20250183079A1 patent drawing

AI summary

A substrate transfer system comprises a transfer unit having a holding member configured to hold at least two substrates, a plurality of mounting tables, support members that are provided to each of the mounting tables and are capable of moving relatively in a vertical direction with respect to each of the mounting tables, and a plurality of movement units that independently move each of the support members in the horizontal direction. A position adjustment of each of the substrates with respect to each of the mounting tables is performed by a first substrate movement, in which each of the substrates in a state of being held by the holding member is moved by the transfer unit, and a second substrate movement, in which each of the substrates in a state of being supported by each of the support members is moved by the movement units.