Substrate Transfer Position Control for Film Thickness Uniformity
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Solution Overview
Problem
In semiconductor manufacturing, achieving uniform film thickness on substrates is challenging due to eccentricity issues, which are currently addressed through operator-dependent adjustments lacking clear indices, resulting in variable improvement times and process performance.
Innovation Solution
A substrate processing apparatus with a transfer device, controller, and information processing unit that uses film thickness measurements to determine optimal substrate placement, analyzing eccentricity states, updating models, and optimizing transfer positions to minimize film thickness variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If operator-dependent adjustments are used to address eccentricity, then film thickness uniformity can be improved, but adjustment time varies and process performance becomes variable
Solution Approach 1:
The system implements feedback control by measuring film thickness at multiple positions on the substrate, analyzing the measurement results to determine eccentricity, and automatically adjusting the substrate transfer device to correct the placement position. This closed-loop feedback mechanism eliminates operator dependency and ensures consistent adjustment time while improving film thickness uniformity.
Solution Approach 2:
The system performs self-diagnosis and self-correction by automatically analyzing film thickness measurements, determining eccentricity states, and adjusting substrate placement without operator intervention. The apparatus serves itself by using its own measurement data to identify and correct placement errors, ensuring repeatable process performance.
2Manufacturing precision
If operator-dependent adjustments are used to address eccentricity, then film thickness uniformity can be improved, but process performance becomes variable
Solution Approach 1:
The system uses feedback control to consistently improve film thickness uniformity. By measuring film thickness at multiple positions, analyzing the data to determine eccentricity, and automatically adjusting substrate placement based on this feedback, the system achieves reliable and repeatable process performance without operator variability.
Solution Approach 2:
The system replaces manual operator adjustments with an automated control system that uses measurement data and algorithms to determine optimal substrate placement positions. This substitution of mechanical/operator-based adjustment with an automated feedback system ensures consistent and reliable process performance.
3Loss of time
If film thickness measurements are used to determine optimal substrate placement, then adjustment time is reduced, but measurement and analysis systems are required
Solution Approach 1:
The system uses film thickness measurement feedback to rapidly determine optimal substrate placement. By measuring film thickness at multiple positions and using this data to calculate eccentricity and adjust placement, the system reduces adjustment time while the added measurement and analysis capabilities are integrated into the existing control system.
Data Source
AI summary
A substrate processing method includes: carrying out a substrate from a substrate transfer container by a substrate transfer device; placing the substrate in a first position of a substrate holder; moving the substrate holder into a reaction container and processing the substrate in the reaction chamber; obtaining a film thickness measurement result of the substrate processed in the reaction container; creating a model from the film thickness measurement result; determining a second position where the substrate is placed in the substrate holder and a transfer position setting value obtained from the model; adjusting the first position of the substrate to the second position; calculating an eccentricity state of the substrate from a newly obtained film thickness measurement result; calculating an optimization such that the eccentricity state is minimized; and determining a third position to which a new substrate is placed from the transfer position setting value.