Substrate Transfer Chamber With Immersed Posture Change

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in maintaining substrate posture consistency during transitions between batch and single-wafer processing, leading to issues like pattern leaning and water marks, while also risking contamination from particles during transfer.

Innovation Solution

The apparatus incorporates a first and second processing unit with buffer baths and transfer robots to manage substrate posture changes and minimize exposure to air, using a first transfer robot to change substrates from vertical to horizontal while immersed and a second robot to reverse the posture after processing, with separate hands for different processing stages to prevent contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If substrates are transferred from batch processing to single-wafer processing by changing posture, then processing flexibility is improved, but pattern leaning occurs on the pattern formed on substrates

Engineering Contradiction:

Improveprocessing flexibilityVSAvoidpattern alignment

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

A transfer chamber is introduced as an intermediary space between the batch processing unit and single-wafer processing unit. This transfer chamber contains a transfer robot that can hold and reposition substrates without exposing them to external air, thereby preventing pattern leaning while enabling flexible posture changes for different processing modes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The transfer chamber is maintained at a controlled atmosphere (inert or vacuum environment) to prevent air exposure during substrate transfer and posture change operations. This inert environment protects the patterns on substrates from leaning while allowing the system to switch between batch and single-wafer processing modes.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Ease of operation

If substrates are exposed to air for a long time during transfer, then transfer operations are simplified, but water marks form on substrates due to loss of wettability

Engineering Contradiction:

Improvetransfer operation simplicityVSAvoidsubstrate surface quality

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The transfer chamber maintains a controlled inert or vacuum atmosphere throughout the substrate transfer and posture change operations. This prevents air exposure that would cause water mark formation, while the enclosed environment allows for complete transfer operations including posture changes without simplifying constraints.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The transfer chamber acts as a protected intermediary environment where substrates can be fully transferred and repositioned without air exposure. This mediator space enables complete transfer operations while maintaining substrate surface quality through controlled atmosphere.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If substrates are transferred in vertical posture, then space utilization is improved, but contamination from particles remaining on substrates occurs during transfer

Engineering Contradiction:

Improvespace utilizationVSAvoidparticle contamination

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The transfer chamber maintains a controlled inert or vacuum atmosphere that prevents particle contamination during substrate transfer. This protected environment allows substrates to be transferred in vertical posture (maintaining space utilization) while preventing harmful particle deposition on the substrate surfaces.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Data Source

PatentUS20250364283A1Apparatus for treating a substrate and method for treating a substrate

Publication Date: 2025.11.27 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

The apparatus includes a first processing unit having a batch processing bath that processes a plurality of substrates in a vertical posture in a batch; a second processing unit adjacent to the first processing unit; and a transfer unit transferring the plurality of substrates in the vertical posture between the first and second processing unit, wherein the second processing unit includes a transfer chamber; a plurality of process chamber disposed around the transfer chamber and processing substrates in a horizontal posture one by one; a first buffer bath disposed in the transfer chamber and providing an accommodation space in which a plurality of substrates in a vertical posture stands by while being immersed in a processing solution; a first transfer robot changing the substrates disposed in the first buffer bath from the vertical posture to the horizontal posture, and transferring substrates between the first buffer bath and the process chambers.