Substrate Transfer Layout With Posture Turning for Flexible Tool Configuration

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Solution Overview

Problem

Conventional substrate treatment systems face difficulties in freely changing the configurations of batch treatment devices and single-wafer treatment devices due to the fixed arrangement of interface devices, which restricts flexibility and requires cumbersome adjustments when the length of the batch treatment device is modified.

Innovation Solution

A substrate treatment system design that includes a batch treatment device, a single-wafer treatment device, and an interface device with a posture turning mechanism, allowing the batch treatment device to extend in one direction while the single-wafer treatment device is positioned orthogonally, and an interface device with a relay region that can change configurations without intersecting the batch substrate transport region, enabling flexible adjustments without altering the transfer block or interface device configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the batch treatment device is lengthened in the front-rear direction, then the treatment capacity is improved, but the transport path of the interface device or single-wafer treatment device must be changed

Engineering Contradiction:
Improvetreatment capacityVSAvoidtransport path configuration
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent positions the single-wafer treatment device to face the batch treatment device in the width direction (orthogonal dimension) rather than arranging it in the front-rear direction. This dimensional change allows the batch treatment device to be extended in the front-rear direction without affecting the transport path of the interface device or single-wafer treatment device, as they are now arranged in different spatial dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If the interface device is fixed on the rear side, then the system structure is simplified, but the flexibility to change batch treatment device configuration is restricted

Engineering Contradiction:
Improvesystem structureVSAvoidconfiguration flexibility
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent creates a dynamic and flexible system layout where the batch treatment device can be extended in the front-rear direction while the interface device remains positioned on the rear side. The single-wafer treatment device is positioned to face the batch treatment device, allowing the batch treatment device length to be adjusted without requiring movement or reconfiguration of the interface device, thus achieving both structural simplicity and configuration flexibility.

Inventive Principle:
Principle #15Dynamics

3Area of stationary object

If the batch treatment device and single-wafer treatment device are arranged in a line, then the layout is compact, but the maintenance area is limited

Engineering Contradiction:
Improvelayout compactnessVSAvoidmaintenance area
Core Design Contradiction:
Area of stationary objectVSEase of repair

Solution Approach 1:

The patent arranges the single-wafer treatment device to face the batch treatment device in the width direction, creating a compact layout while simultaneously providing access to the front side of both devices. This orthogonal arrangement allows maintenance personnel to access the front of the batch treatment device and the front of the single-wafer treatment device without requiring extensive disassembly, thus securing wide maintenance areas while maintaining layout compactness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentEP4489063A1Substrate treatment system
Publication Date: 2025.01.08 SCREEN HOLDINGS CO LTD
  • EP4489063A1 patent drawingFigure 1
  • EP4489063A1 patent drawingFigure 2A~2C
  • EP4489063A1 patent drawingFigure 3

AI summary

A substrate treatment system includes a batch treatment device, a single-wafer treatment device, and an interface device that connects the batch treatment device and the single-wafer treatment device. The batch treatment device extends to a rear side. The single-wafer treatment device faces the batch treatment device to be aligned in a width direction orthogonal to the rear side. The interface device is disposed adjacent to one end side of each of the batch treatment device and the single-wafer treatment device to extend in the width direction. The batch substrate transport region of the batch treatment device is disposed adjacent to a transfer block and a treatment block on a side where the single-wafer treatment device is disposed. The interface device includes a posture turning region and a relay region. The posture turning region is disposed on an opposite side to the treatment block via the transfer block.