Substrate Transfer Chamber Preheating to Prevent Thermal Shock
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Solution Overview
Problem
Temperature differences between semiconductor substrates and transfer components lead to thermal shock, reduced processing efficiency, and lower throughput in semiconductor manufacturing, particularly exacerbated by complex high-temperature deposition operations.
Innovation Solution
A transfer apparatus and method involving a transfer chamber with heat sources and thermal sensors, where substrates are pre-heated and pre-cooled using motors and substrate holders to align with heat sources, ensuring uniform temperature and reducing thermal shock by controlling heating and cooling processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are transferred directly without temperature adjustment, then handling time is reduced, but thermal shock occurs causing substrate bowing and damage
Solution Approach 1:
The substrate holder is pre-heated or pre-cooled to match the substrate temperature before the substrate is transferred onto it. This preliminary temperature adjustment prevents thermal shock during the transfer operation, eliminating substrate bowing and damage while maintaining efficient handling times.
2Reliability
If substrate transfer apparatus is pre-heated, then thermal shock is reduced, but energy consumption increases
Solution Approach 1:
Heating is applied locally to only the substrate holder and immediate transfer components that will contact the substrate, rather than heating the entire transfer apparatus. This localized approach reduces energy consumption while still preventing thermal shock at the critical interface where substrate contact occurs.
3Manufacturing precision
If complex deposition operations are performed, then device performance is improved, but temperature control difficulty increases
Solution Approach 1:
Temperature sensors continuously monitor the substrate holder temperature during deposition operations, and the control system adjusts heating power in real-time to maintain the desired temperature profile. This feedback control enables precise temperature management during complex deposition processes, ensuring uniform deposition while simplifying operator control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal shock, enhances deposition uniformity, increases processing efficiency, and improves throughput by maintaining consistent substrate temperatures during handling and processing.
Implementation Method 1
one or more heat sources configured to direct heat into the internal volume through the window
Implementation Method 2
a window that includes a transparent material, and one or more heat sources configured to direct heat into the internal volume through the window
Data Source
AI summary
The present disclosure relates to transfer chambers, systems, and related components and methods, for pre-heating and pre-cooling substrate transfer apparatus. In one or more embodiments, the transfer apparatus are pre-heated and pre-cooled in relation to transferring substrates for substrate processing operations as part of semiconductor manufacturing. In one or more embodiments, a transfer chamber applicable for use in semiconductor manufacturing includes an internal volume, one or more sidewalls at least partially defining the internal volume, and a transfer apparatus disposed in the internal volume. The transfer apparatus includes one or more links, one or more motors configured to pivot the one or more links, and one or more substrate holders coupled to the one or more links. The transfer chamber includes a window that includes a transparent material, and one or more heat sources configured to direct heat into the internal volume through the window.