Substrate Transfer Blades and Carrier to Prevent Wafer Re-Contamination
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Solution Overview
Problem
The semiconductor manufacturing process faces challenges in reducing particle defects on substrates during the formation of fine photoresist patterns, particularly due to contamination and the collapse of patterns during high-speed rotation in EUV lithography, which existing substrate transferring units fail to address effectively.
Innovation Solution
A substrate processing apparatus and method featuring a substrate transferring unit with dedicated blades for dry and wet substrates, along with a carrier for temporary storage, to prevent re-contamination and ensure efficient processing through distinct handling of substrate states, including developing, drying, baking, and cooling processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single substrate transferring unit is used for both dry and wet substrates, then the device complexity is reduced, but particle defects increase due to re-contamination
Solution Approach 1:
The substrate transferring unit is segmented into two distinct units: a first substrate transferring unit for dry substrates and a second substrate transferring unit for wet substrates. This segmentation prevents cross-contamination between dry and wet processing stages, thereby reducing particle defects while maintaining manageable device complexity through functional separation.
2Productivity
If substrates are transferred directly between process chambers without intermediate storage, then the productivity is improved, but manufacturing precision deteriorates due to contamination risk
Solution Approach 1:
An intermediate storage chamber is introduced as a mediator between the process chambers. Wet substrates are transferred to this intermediate chamber after washing, allowing dry substrates to be processed simultaneously without contamination risk. This intermediary storage maintains substrate cleanliness while enabling continuous high-throughput processing.
3Device complexity
If the substrate processing apparatus handles both dry and wet substrates in the same chamber, then the device complexity is reduced, but manufacturing precision decreases due to contamination
Solution Approach 1:
The processing system is segmented into separate first and second process chambers, with the first chamber handling dry substrates and the second chamber handling wet substrates. This spatial segmentation eliminates cross-contamination between dry and wet processes, ensuring high substrate purity while maintaining reasonable device complexity through modular chamber design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces particle defects on substrates by preventing contamination and improving process efficiency and manufacturing yield through separate handling of dry and wet substrates, ensuring precise control throughout the processing stages.
Implementation Method 1
a first blade configured to transfer the substrate that is in the dry state
Implementation Method 2
a second blade configured to transfer the substrate that is in the wet state
Implementation Method 3
a carrier configured to temporarily store the substrate that is in the dry state
Implementation Method 4
a second process chamber configured to perform a drying process on the substrate by supplying a supercritical fluid to the substrate
Implementation Method 5
supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state
Data Source
AI summary
A substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.