Substrate Transfer Device Segmented Support Elevation Dust Control

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Solution Overview

Problem

Existing substrate transfer methods in substrate processing apparatuses face challenges in preventing dust generation from substrate peripherals and minimizing adverse effects on processed substrates due to pre-processed substrates, and lack effective monitoring of support elevation states.

Innovation Solution

A substrate transfer device with a first and second supporting portion and an elevating mechanism that supports the substrate from below, with the second supporting portion movable between two height positions, and a detecting mechanism to verify the actual elevation state of the supporting portions, ensuring different contact points before and after processing and preventing contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a substrate is supported by being inclined between multiple holders having multi-level support surfaces, then the substrate can be transferred while suppressing adverse effects on processed substrates, but the peripheral portion of the substrate comes into contact with the holders causing film cutting and dust generation

Engineering Contradiction:
Improveadverse effects on processed substratesVSAvoiddust generation from peripheral portion
Core Design Contradiction:
Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The support structure is segmented into multiple independent support portions (first support portion and second support portion) that can be positioned at different heights. This segmentation allows the substrate to be supported at multiple discrete points rather than along its periphery, preventing film cutting and dust generation while maintaining the ability to suppress adverse effects on processed substrates through controlled inclination.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are supported at different heights by the first and second support portions. The first support portion supports a first region at a first height while the second support portion supports a second region at a second height, creating local height variations that prevent peripheral contact with holders while maintaining substrate stability and preventing dust generation.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If multiple pads are provided as one set with movable elevation by diaphragm pump, then substrate before processed and after processed can be supported at different positions, but it is not checked whether the pads are actually elevated into the required elevation state

Engineering Contradiction:
Improvedifferent elevation states for different substratesVSAvoidelevation state verification
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

A detection mechanism is introduced that provides feedback on the actual elevation state of the support portions. The detection mechanism detects whether the first support portion and second support portion are at their respective first and second heights, ensuring that the substrate is properly positioned before processing and preventing errors due to incorrect elevation states.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS11244849B2Substrate transfer device and substrate transfer method
Publication Date: 2022.02.08 TOKYO ELECTRON LTD
  • US11244849B2 patent drawing
  • US11244849B2 patent drawing
  • US11244849B2 patent drawing

AI summary

Generation of dust from a peripheral portion of a substrate can be suppressed, and a processed substrate can be suppressed from being adversely affected by a pre-processed substrate. Further, an actual elevation state of the member configured to be moved up and down to support the substrate can be investigated. A substrate transfer device includes a first supporting portion, a second supporting portion and an elevating mechanism. The first supporting portion and the second supporting portion are configured to support a substrate from below the substrate. The elevating mechanism is configured to elevate the second supporting portion up and down between a first position higher than a height of the first supporting portion and a second position lower than the height of the first supporting portion. The substrate transfer device further includes a detecting mechanism configured to detect an elevation state of the second supporting portion.