Substrate Transfer Sensor Calibration for Plasma Uniformity

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Solution Overview

Problem

Existing substrate processing systems face challenges in accurately transferring substrates due to deviations in the positional relationship between the substrate and the support, which affects the uniformity of plasma processing.

Innovation Solution

A calibration method is introduced that involves placing the substrate on a support such that its center position is within an allowable range from the support's center, and then using a transfer device and sensors to detect and calibrate the substrate's position, ensuring accurate transfer and placement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If substrate position is detected using existing sensor systems, then transfer position can be corrected, but transfer accuracy is insufficient due to substrate deviation from support center

Engineering Contradiction:
Improvesubstrate position detection accuracyVSAvoidtransfer accuracy
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The substrate is preliminarily positioned on the support part with its center aligned to the support center before transfer. This preliminary positioning action ensures that the substrate starts from a known reference position, enabling the sensor to accurately detect the support's position and thereby improve transfer accuracy.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The support part serves as an intermediary between the substrate and the detection system. By detecting the support part's position rather than directly detecting the substrate, the system achieves more accurate position measurement since the support part has a well-defined geometric center that can be reliably detected by the sensor.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If substrate center position is not controlled relative to support center, then placement is simpler, but in-plane uniformity of plasma processing deteriorates

Engineering Contradiction:
Improvesubstrate placement simplicityVSAvoidin-plane uniformity of plasma processing
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The system uses sensor detection to obtain feedback on the support part's position, and the controller adjusts the transfer device based on this feedback to ensure the substrate center aligns with the support center. This closed-loop feedback mechanism achieves precise alignment without complicating the placement operation.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS20250125173A1Calibration Method and Substrate Processing System
Publication Date: 2025.04.17 TOKYO ELECTRON LTD
  • US20250125173A1 patent drawing
  • US20250125173A1 patent drawing
  • US20250125173A1 patent drawing

AI summary

Provided is a calibration method for calibrating a sensor in a system including a transfer device for transferring an object, and the sensor for detecting the object to recognize a position of the object that is being transferred by the transfer device, the method comprising: (A) placing the object on a support part configured to support the object such that a center position of the object is located within an allowable range from a center position of the support part; and (B) after said (A), holding and transferring the object placed on the support part by the transfer device, detecting the object that is being transferred by the sensor, and calibrating the position of the object detected by the sensor.