Substrate Transfer Chamber Layout for Atmospheric-to-Vacuum Processing

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in increasing productivity due to limitations in transferring substrates between different atmospheric conditions, particularly between atmospheric and vacuum environments.

Innovation Solution

Incorporation of an atmospheric transfer structure and intermediate structures that facilitate the transfer of substrates between atmospheric and vacuum processing environments, allowing for efficient handling and processing of substrates in a vacuum atmosphere.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If substrates are transferred directly between atmospheric and vacuum environments, then transfer speed is improved, but substrate contamination and processing reliability deteriorate

Engineering Contradiction:
Improvetransfer speedVSAvoidprocessing reliability
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The transfer system is divided into multiple independent chambers (first transfer chamber, intermediate chamber, second transfer chamber) that can operate independently. Each chamber maintains its own pressure environment, allowing substrates to be transferred through staged pressure transitions rather than direct atmospheric-to-vacuum transfer, thus preventing contamination while maintaining efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The intermediate chamber acts as a mediator between atmospheric and vacuum environments. It provides a buffer zone with controllable pressure that facilitates smooth transition of substrates between different pressure regimes, preventing direct exposure to harsh pressure differentials that cause contamination

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If multiple transfer chambers are introduced, then substrate contamination is reduced, but device complexity increases

Engineering Contradiction:
Improvesubstrate protectionVSAvoidtransfer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Each transfer chamber is designed as a multi-functional unit that can handle both atmospheric and vacuum conditions, serve as both a transfer pathway and a pressure buffer, and accommodate different substrate types. This universal design reduces the need for specialized components for each function, thereby limiting complexity growth

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The intermediate chamber is positioned within the vacuum environment but functions as a bridge to atmospheric pressure. The chambers are nested in a hierarchical structure where the intermediate chamber contains the transition zone, allowing compact arrangement that minimizes overall system footprint and complexity

Inventive Principle:
Principle #7Nested doll (Nesting)

3Productivity

If intermediate structures are added for pressure transition, then productivity is improved, but device complexity increases

Engineering Contradiction:
Improvesubstrate processing throughputVSAvoidchamber structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The intermediate chamber enables continuous substrate transfer operations by maintaining ready-state pressure conditions and allowing parallel operations in different chambers. While one chamber is transferring a substrate, another can be preparing the next one, ensuring continuous productive action without idle time

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

Pressure conditions in the intermediate chamber are pre-adjusted and maintained in readiness before substrate arrival. This preliminary preparation of the transfer environment eliminates delays during actual substrate transfer, maximizing productivity while the chamber structure remains fixed and manageable

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20260076137A1Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium
Publication Date: 2026.03.12 KOKUSAI DENKI KK
  • US20260076137A1 patent drawing
  • US20260076137A1 patent drawing
  • US20260076137A1 patent drawing

AI summary

There is provided a technique that includes: an atmospheric transfer structure configured to transfer a substrate in an atmospheric atmosphere; a plurality of processing structures arranged along the atmospheric transfer structure and configured to be capable of processing the substrate in a vacuum atmosphere; an intermediate structure arranged adjacent to the plurality of processing structures, and configured to receive the substrate from the atmospheric transfer structure and to transfer the substrate to each of the plurality of processing structures in an atmosphere whose pressure is lower than that of the atmospheric atmosphere.