Substrate Transfer Scheduling Across Vacuum Load Locks
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Solution Overview
Problem
Current substrate treating apparatuses face inefficiencies in processing semiconductor and display device substrates due to idle times in process units, transport robots, and load lock chambers, leading to reduced production output.
Innovation Solution
A substrate treating apparatus with a control module that schedules operations across process, index, and loading modules using machine learning techniques, specifically reinforcement learning, to optimize substrate processing and transport, reducing idle times and increasing throughput by managing atmosphere transitions and equipment control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate processing is performed using conventional equipment scheduling, then the equipment can operate with standard control, but idle times in process units, transport robots, and load lock chambers increase, reducing productivity
Solution Approach 1:
The patent implements dynamic scheduling that adapts to real-time equipment states. The control module continuously monitors operation states of process units, transport robots, and load lock chambers, and dynamically adjusts the substrate processing schedule to minimize idle times. This dynamic approach allows the system to respond to changing conditions and optimize throughput continuously rather than relying on static schedules.
Solution Approach 2:
The patent applies preliminary action by pre-planning and optimizing the substrate processing schedule based on equipment characteristics and process requirements. The control module generates optimized schedules in advance that anticipate equipment availability and process durations, allowing the system to minimize idle times before they occur rather than reacting to them after they happen.
2Adaptability or versatility
If the equipment operates with multiple process modules and atmosphere switching, then substrate processing capability is enhanced, but the complexity of coordinating operations between modules increases
Solution Approach 1:
The patent implements feedback mechanisms where the control module continuously receives operation state information from all process modules, transport robots, and load lock chambers. This feedback is used to adjust and optimize the scheduling of substrate processing operations. The system monitors atmosphere switching states, module availability, and process progress, using this information to coordinate operations efficiently and reduce coordination complexity through intelligent control.
3Adaptability or versatility
If atmosphere switching between vacuum and atmospheric pressure is implemented, then substrate can be processed and transferred between different pressure environments, but the time required for exhaust and intake operations increases
Solution Approach 1:
The patent applies preliminary action by preparing the load lock chamber atmosphere in advance before substrate transfer is needed. The control module monitors substrate processing status and initiates atmosphere switching operations proactively, so that when a substrate needs to be transferred between vacuum and atmospheric pressure environments, the atmosphere is already ready, minimizing the actual transfer time and reducing the impact of exhaust and intake operations on overall productivity.
Data Source
AI summary
A substrate treating apparatus and a substrate treating method are disclosed. The substrate treating apparatus includes a process module configured to perform processing on a substrate, an index module configured to insert the substrate into the process module and withdraw the substrate, of which the processing is completed, from the process module, a loading module configured to relay the substrate between the process module in a vacuum atmosphere and the index module in an atmospheric pressure atmosphere by switching an atmosphere thereof to the vacuum atmosphere or the atmospheric pressure atmosphere, and a control module configured to receive operation states from the process module, the index module, and the loading module and schedule operations of the process module, the index module, and the loading module in a direction in which the number of substrates to be processed per unit time increases with reference to the received operation states.