Substrate Transfer Apparatus Vertical Elevating Mechanism

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Solution Overview

Problem

In batch-type processing apparatuses, the complex transfer path between substrate accommodation vessels and processing apparatuses leads to prolonged substrate changing times, reducing the overall throughput of the substrate processing system.

Innovation Solution

A substrate transfer apparatus with independent multi-stage substrate accommodation units and holders, utilizing elevating mechanisms to move substrates vertically between accommodation units and holders, eliminating the need for revolving operations and optimizing the transfer route for faster substrate exchange.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a complex transfer path with revolving operations is used to transfer substrates between substrate accommodation vessels and processing apparatus, then the transfer apparatus can accommodate multiple substrates in multi-stage, but the substrate transfer time is prolonged

Engineering Contradiction:
Improvenumber of substrates accommodatedVSAvoidsubstrate transfer time
Core Design Contradiction:
Quantity of substanceVSLoss of time

Solution Approach 1:

The transfer apparatus is divided into separate loading and unloading arms that operate independently. The loading arm is dedicated to transferring unprocessed substrates from the first substrate accommodation unit to the processing apparatus, while the unloading arm handles processed substrates from the processing apparatus to the second substrate accommodation unit. This segmentation eliminates the need for complex revolving operations to switch between loading and unloading functions, thereby reducing substrate transfer time while maintaining multi-stage accommodation capability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces vertical elevation mechanisms to create a three-dimensional transfer path. The loading arm includes a first elevating mechanism that moves substrates vertically between the first substrate accommodation unit and the processing apparatus, while the unloading arm includes a second elevating mechanism for vertical movement between the processing apparatus and the second substrate accommodation unit. This dimensional change allows direct vertical transfer routes without horizontal revolving operations, significantly reducing transfer time

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If independent loading and unloading arms are installed to improve substrate changing speed, then the substrate exchange time is reduced, but the transfer path becomes complicated

Engineering Contradiction:
Improvesubstrate exchange speedVSAvoidtransfer path complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The transfer apparatus is divided into separate loading and unloading arms that operate independently. The loading arm is dedicated to transferring unprocessed substrates from the first substrate accommodation unit to the processing apparatus, while the unloading arm handles processed substrates from the processing apparatus to the second substrate accommodation unit. This segmentation eliminates the need for complex revolving operations to switch between loading and unloading functions, thereby reducing substrate transfer time while maintaining multi-stage accommodation capability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces vertical elevation mechanisms to create a three-dimensional transfer path. The loading arm includes a first elevating mechanism that moves substrates vertically between the first substrate accommodation unit and the processing apparatus, while the unloading arm includes a second elevating mechanism for vertical movement between the processing apparatus and the second substrate accommodation unit. This dimensional change allows direct vertical transfer routes without horizontal revolving operations, significantly reducing transfer time

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8545160B2Substrate transfer apparatus and substrate transfer method
Publication Date: 2013.10.01 TOKYO ELECTRON LTD
  • US8545160B2 patent drawing
  • US8545160B2 patent drawing
  • US8545160B2 patent drawing

AI summary

A substrate transfer apparatus that transfers a substrate with respect to a processing apparatus includes a substrate accommodation unit for accommodating a plurality of substrates to be loaded into the processing apparatus in a vertical direction in a multi-stage; a substrate accommodation unit for accommodating a plurality of substrates unloaded from the processing apparatus in a vertical direction in a multi-stage; a substrate holder for transferring the substrates from the substrate accommodation unit to the processing apparatus; a substrate holder for transferring the substrates from the processing apparatus to the substrate accommodation unit. The substrate accommodation unit has an elevating mechanism for moving at least one of the substrate and the substrate holder in a vertical direction relative to each other and the substrate accommodation unit has an elevating mechanism for moving at least one of the substrate and the substrate holder in a vertical direction relative to each other.