Substrate Transfer Method with Vertical Matrix Picks
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Solution Overview
Problem
The existing substrate transfer methods in semiconductor manufacturing are inefficient due to challenges in precise alignment and position adjustment of wafers during the transfer process.
Innovation Solution
A substrate transfer method involving vertically spaced picks and pedestals with distinct alignment positions, utilizing a Bernoulli chuck mechanism for efficient vertical positioning and temperature control, allows for precise alignment and transfer of wafers between the transfer device and the orientor, enabling efficient position adjustment and transfer capability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single pick is used to transfer substrates sequentially, then the device structure is simple, but the alignment efficiency is low due to sequential processing
Solution Approach 1:
The transfer device is divided into multiple independent picks (first pick, second pick, third pick, fourth pick) arranged in a matrix pattern, allowing parallel processing of multiple substrates simultaneously. Each pick operates independently to transfer substrates from different positions of the alignment device to different positions of the processing device, thereby improving alignment efficiency without requiring a complete redesign of the transfer mechanism.
Solution Approach 2:
Multiple picks are combined into a single integrated transfer device that operates as one coordinated system. The picks work in parallel but are controlled by a unified control mechanism, merging the functionality of multiple transfer operations into a single device structure. This approach achieves high productivity while maintaining relatively simple device complexity.
2Productivity
If multiple picks are used for parallel substrate transfer, then the alignment efficiency is improved, but the device complexity increases
Solution Approach 1:
The picks are arranged in a vertical matrix pattern rather than a horizontal linear arrangement. This three-dimensional configuration allows multiple picks to occupy different vertical positions while maintaining a compact horizontal footprint. By utilizing the vertical dimension, the device achieves parallel processing capability without proportionally increasing the horizontal space and structural complexity.
Solution Approach 2:
Each pick in the matrix is designed with identical structure and functionality, allowing any pick to transfer substrates from any alignment position to any processing position. This universal design reduces the overall device complexity by using standardized components rather than specialized picks for each position, while still enabling parallel processing of multiple substrates.
3Speed
If sequential substrate transfer is used, then the device structure is simple, but the transfer time is long
Solution Approach 1:
The multiple picks operate simultaneously and continuously to transfer substrates in parallel. While one pick is transferring a substrate, other picks are performing their transfer operations at the same time, eliminating idle time and ensuring continuous productive action. This parallel continuous operation significantly increases transfer speed compared to sequential transfer, while the picks share common support structures to control the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the efficiency of wafer position adjustment and transfer by reducing the number of arm expansions/contractions, improving transfer capability, and allowing parallel position detection, which saves space and reduces costs.
Implementation Method 1
utilizing a Bernoulli chuck mechanism for efficient vertical positioning
Data Source
AI summary
A substrate transfer method includes a step of placing a first and a second substrate on a first and a second alignment part which are arranged to be vertically spaced from each other by using a first and a second pick. The method further includes a first positioning step of positioning the first pick at a first reception position determined based on an alignment position for the first substrate, a first receiving step of receiving the first substrate from the first alignment part by moving the first pick. The method further includes a second positioning step of positioning the second pick at a second reception position determined based on an alignment position for the second substrate, and a second receiving step of receiving the second substrate from the second alignment part by moving the second pick.