Substrate Transfer System with Vertical Segmentation
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Solution Overview
Problem
The existing substrate processing systems face challenges in increasing the number of wafers transferred per unit time due to a heavy load on the substrate transfer apparatuses, particularly when accessing inverting devices or other processing units.
Innovation Solution
The system incorporates multiple first and second transfer apparatuses, accommodating units, and processing units arranged in a vertical direction, with delivery apparatuses transferring wafers between these units to reduce the processing load on the second transfer apparatuses, allowing for parallel processing and shorter moving distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate transfer apparatus transfers substrates to substrate processing units and inverting device, then the substrate processing function is complete, but the substrate transfer apparatus becomes overloaded and transfer speed decreases
Solution Approach 1:
The substrate transfer system is segmented into multiple independent transfer apparatuses (first transfer apparatus for loading, second transfer apparatus for processing, third transfer apparatus for unloading) and multiple accommodating units (first accommodating unit, second accommodating unit). This segmentation distributes the transfer load across multiple parallel pathways, preventing any single transfer apparatus from becoming overloaded and maintaining high transfer throughput.
2Area of stationary object
If multiple substrate processing units are stacked in height direction, then space utilization improves, but transfer path length increases and transfer efficiency decreases
Solution Approach 1:
The system utilizes both vertical stacking (height direction) and horizontal arrangement of substrate processing units. Multiple accommodating units are positioned at different heights and horizontally distributed, with transfer apparatuses operating in both vertical and horizontal dimensions. This multi-dimensional arrangement shortens the effective transfer path length compared to purely vertical stacking, as substrates can be transferred to nearby units in the horizontal plane rather than traversing long vertical distances.
Data Source
AI summary
A first transfer apparatus unloads and transfers substrates from a cassette. A first accommodating unit accommodates the substrates. First substrate processing units divided into at least two groups and arranged in a height direction performs a process to the substrates. Second accommodating units respectively corresponding to the groups are arranged to be parallel with the first accommodating unit in the height direction. Second transfer apparatuses respectively corresponding to the groups unload and transfer the substrates from the second accommodating units corresponding to the same groups into the first substrate processing units of the same groups. Second substrate processing units respectively corresponding to the groups are arranged to be parallel with the first and second accommodating units in the height direction. A delivery apparatus delivers the substrates between the first and second accommodating units and transfers the substrates between the first accommodating unit and the second substrate processing units.