Substrate Transfer Alignment for Precise Wafer Centering
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Solution Overview
Problem
Existing substrate processing systems face challenges in achieving accurate centering of substrates, particularly semiconductor wafers, due to inclined orientations of substrate transfer units, which hinder precise placement and processing.
Innovation Solution
The implementation of a substrate processing apparatus equipped with a substrate transfer unit, first detection unit, second detection unit, and third detection unit, which utilize optical sensors to detect positional shifts and inclination of the substrate transfer unit relative to the processing unit, enabling precise correction and alignment of the substrate during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrate transfer unit is used to carry substrate in substrate processing unit, then substrate transfer capability is improved, but centering accuracy deteriorates due to inclined orientation of transfer unit
Solution Approach 1:
The system performs preliminary detection of the substrate transfer unit's position and inclination using detection units before the substrate is placed in the processing unit. Based on these detection results, the system calculates and determines a corrected reference position in advance, so that when substrate placement occurs, the centering accuracy is already optimized despite the transfer unit's inclination.
Solution Approach 2:
The system employs detection units that continuously monitor the position and inclination of the substrate transfer unit. The detected information is fed back to the control unit, which adjusts the reference position dynamically. This closed-loop feedback mechanism ensures that centering accuracy is maintained by compensating for the transfer unit's inclination in real-time.
2Manufacturing precision
If detection units are added to detect position and inclination, then centering accuracy is improved, but device complexity increases
Solution Approach 1:
The detection units are designed to perform multiple functions: they detect both the position and inclination of the substrate transfer unit using the same hardware components. This multi-functionality reduces the need for separate detection systems, thereby limiting the increase in device complexity while achieving improved centering accuracy.
Solution Approach 2:
The system replaces complex mechanical adjustment mechanisms with optical or sensor-based detection units that measure position and inclination electronically. The control unit then processes these electronic signals to determine the corrected reference position, substituting mechanical complexity with electronic control and simplifying the overall system structure.
Data Source
AI summary
A substrate processing apparatus according to an aspect of the present disclosure includes a substrate processing unit, a substrate transfer unit, a first detection unit, a second detection unit, and a third detection unit. The substrate processing unit holds and processes a substrate. The substrate transfer unit has a rotational axis and carries the substrate in the substrate processing unit. The first detection unit detects a position of the substrate transfer unit relative to the substrate processing unit in a direction of travel thereof when the substrate is carried in the substrate processing unit in the direction of travel. The second detection unit detects a position of the substrate transfer unit relative to the substrate processing unit in a direction that is perpendicular to the direction of travel. The third detection unit detects an inclination of the rotational axis of the substrate transfer unit relative to the substrate processing unit.