Substrate Transfer Profile for Warpage-Corrected Chucking
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Solution Overview
Problem
Conventional exposure apparatuses fail to adequately address substrate warping during transfer, leading to substrate distortion and potential damage to the chucking surface.
Innovation Solution
A stage apparatus with a substrate holding unit and a control unit that adjusts the driving profile of the substrate based on warpage information to correct substrate warping, using a driving mechanism and vacuum/chucking mechanisms to stabilize the substrate during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is transferred to the chuck using a conventional driving mechanism, then the substrate transfer is completed, but the substrate distortion occurs due to warpage
Solution Approach 1:
The control unit measures substrate warpage before transfer and pre-calculates the driving profile to compensate for warpage. This preliminary measurement and calculation enable the substrate to be transferred in a corrected state, preventing distortion before it occurs during chucking
Solution Approach 2:
The driving mechanism uses a dynamically adjusted driving profile based on measured warpage characteristics. The driving speed and position are continuously optimized during transfer to maintain substrate flatness, transforming a static transfer process into a dynamically controlled one
2Ease of operation
If the warped substrate is chucked directly, then the substrate is held, but the chucking surface is damaged
Solution Approach 1:
The system performs preliminary warpage measurement and calculates compensation parameters before the chucking operation. This advance preparation ensures that the substrate is properly positioned and flattened before contact with the chucking surface, preventing damage
Solution Approach 2:
The control unit acts as an intermediary that processes warpage information and translates it into corrected driving commands. This intermediary function enables indirect correction of substrate warpage through controlled movement, avoiding direct forceful contact that would damage the chucking surface
Data Source
AI summary
A stage apparatus for holding a substrate, including a substrate holding unit including a holding surface that holds the substrate, a driving mechanism configured to transfer the substrate to the holding surface, and a control unit configured to decide, based on warpage information concerning warpage of the substrate measured while the substrate is supported by a supporting surface smaller than the holding surface, a driving profile of the substrate by the driving mechanism in a height direction of the substrate such that the substrate is transferred to the holding surface while the warping of the substrate is corrected.